A conductive terminal electrically connects a conductor of a conductive wire to a circuit board. The conductive terminal includes a body, a clamping portion having a pair of clamping arms, and a solder portion having a pair of solder lugs. The body has an opening through which the conductive wire is inserted and a passage communicating with the opening, the passage receiving the conductive wire and extending perpendicular to a surface of the circuit board. The pair of clamping arms extend from the opening towards the circuit board and obliquely towards each other so as to clamp the conductor of the conductive wire inserted through the opening. The solder portion has a pair of solder lugs extending perpendicular to a lengthwise direction of the passage and soldered to a pair of solder pads on the circuit board.

A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.

An electrical assembly includes a support element which has a body and a surface formed on the body, an electrical functional element arranged on the support element, and a temperature monitoring device arranged on the support element for monitoring a temperature on the electrical functional element. The temperature monitoring device includes a temperature sensor arranged on the surface of the support element, a physical contact element arranged on the surface of the support element, and at least one heat-conducting device embedded in the body of the support element. The at least one heat-conducting device extends at least in sections below the temperature sensor in the body and is thermally connected to the physical contact element via at least one through-connection. The physical contact element is thermally coupled to a coupling surface operatively connected to the electrical functional element.

A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.

A connector for connecting an electrical termination to a printed circuit. The connector has the shape of a metal plate including: a peripheral area for fastening the connector on the printed circuit; a central orifice for inserting the electrical termination; retaining tabs for retaining the electrical termination, each retaining tab extending from the peripheral area towards the central orifice, and includes an elastically deformable portion attaching the retaining tab to the peripheral area and a free end forming an edge of the central orifice, the free end comprising a curve and a sharp edge, the curve and the sharp edge being respectively positioned opposite to each other so that the curve is oriented towards a first face, called removable assembly face, of the metal plate, and that the sharp edge is oriented towards a second face, called permanent assembly face, of the metal plate, opposite to the first face.

A method can include coupling a semiconductor chip and an electrode with a substrate. Bottom and top mold die can be use, where the top mold die define a first space and a second space that is separated from the first space. The method can include injecting encapsulation material to form an encapsulation member coupled to and covering at least a portion of the substrate. The encapsulation member can include a housing unit housing the electrode. The electrode can have a conductive sidewall exposed to, and not in contact with the encapsulation member, such that there is open space between the conductive sidewall of the electrode and the encapsulation member from an uppermost surface to a bottommost surface of the encapsulation member, the substrate can having a portion exposed within the open space, and the encapsulation member can have an open cross-section perpendicular to an upper surface of the substrate.

A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.

Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

The disclosed system may include may include (1) a power socket receptacle that (A) fits within a via of a circuit board and (B) is inserted into the circuit board through one side of the via and (2) a power socket plug that (A) fits within the power socket receptacle and (B) is screwed into the power socket receptacle through another side of the via such that the power socket receptacle and the power socket plug collectively provide electrical continuity across the via. Various other apparatuses, systems, and methods are also disclosed.