Microclip appliance formed from a single conductive planar metal sheet includes portions defined along an elongated length including a pin receiver, a solder paddle and a bridge. The pin receiver includes first and second planar rings, and a spring bar extending from a periphery of the first ring to a periphery of the second ring. The solder paddle is comprised of a portion of the conductive metal sheet distal from the pin receiver and the bridge extends from a peripheral portion of the solder paddle to the second ring. Lateral bends are disposed along a length of the conductive planar metal sheet to facilitate the various portions of the microclip.

A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

In some designs, getting a flexible circuit (flex) to assume a bent state can be helpful in efficiently routing electrically conductive pathways. One efficient way to implement soldering of flexes in a bent state during a reflow operation is to manipulate paneling that hold batches of the flexes to reliably maintain a suitable bend in those flexes. In some embodiments, a flex can be surface mounted to a portion or the whole of an electric device during a reflow operation during which the bent state is maintained by paneling that is at least partially attached to a periphery of the flex. Another solution is to utilize vacuum or hot glue fixtures to maintain a bend in the flex during surface mounting and reflow operations.

An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.

A connector for connecting an electrical termination to a printed circuit. The connector has the shape of a metal plate including: a peripheral area for fastening the connector on the printed circuit; a central orifice for inserting the electrical termination; retaining tabs for retaining the electrical termination, each retaining tab extending from the peripheral area towards the central orifice, and includes an elastically deformable portion attaching the retaining tab to the peripheral area and a free end forming an edge of the central orifice, the free end comprising a curve and a sharp edge, the curve and the sharp edge being respectively positioned opposite to each other so that the curve is oriented towards a first face, called removable assembly face, of the metal plate, and that the sharp edge is oriented towards a second face, called permanent assembly face, of the metal plate, opposite to the first face.

includes a heat sink, a circuit substrate including a one chip to constitute a power semiconductor module., a copper nut terminal selectively disposed on the heat sink or the at least one circuit substrate and electrically connected with the chip through wires and being used as a bridge between an external current and an internal current of the power semiconductor module, a plastic housing side wall defining therein a filling space, and an insulating glue injected into the filling space to cover the circuit substrate. The improved power semiconductor module packaging structure of the present invention can significantly reduce electromagnetic radiation and is more suitable for large current applications.