A printed circuit body includes a bus bar as a metal member electrically connected with a connected body, an insulator layer providing insulation properties, and a conductor layer formed across the metal member and the insulator layer and electrically connected with the metal member. The metal member and the insulator layer are positioned such that a metal-member side connected surface of the metal member on which the conductor layer is provided and an insulator-layer side connected surface of the insulator layer on which the conductor layer is provided are positioned at an identical plane. This configuration allows connection between the bus bar and the conductor layer and circuit formation to be simultaneously achieved at manufacturing of the printed circuit body, thereby facilitating formation of a wiring structure of the bus bar and the conductor layer.

A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.

A module substrate includes a plurality of electronic components mounted on at least one surface of a base substrate and a columnar terminal connection substrate connected to the one surface of the base substrate on which a plurality of the electronic components are mounted. The terminal connection substrate includes a plurality of conductor portions, at least one corner of the columnar terminal connection substrate is chamfered with a flat surface and/or curved surface, and the terminal connection substrate is connected at a side surface thereof contacting the chamfered surface, to the one surface of the base substrate.

A three-dimensional mounting structure includes a first mounting component, a second mounting component facing the first mounting component, a connecting layer disposed between the first mounting component and the second mounting component, a third mounting component, an adhesive layer, and a barrier sheet. The first mounting component includes a first end surface. The third mounting component is bonded on the first end surface through the adhesive layer. The connecting layer includes a second end surface close to the first end surface. The three-dimensional mounting structure can avoid the adhesive layer overflowing from the first end surface to the second end surface and improve the electronic product yield. A method for assembling the three-dimensional mounting structure is also disclosed.

A power module (100) arranged to receive an input voltage and to deliver an output voltage, comprising a supporting layer (110) with first and second main surfaces (111, 109) and a rim (122) surrounding the main surfaces. The power module (100) also comprises at least one component (112, 113, 114, 115) on or in the supporting layer (110) which protrudes a first perpendicular distance (d.sub.1) from one of the main surfaces. The power module (100) additionally comprises connectors (116-119; 120-123) for attaching the power module (100) to an external component (10). The one or more connectors (116-119; 120-123) protrude a second distance (d.sub.2) from said rim (122) in a perpendicular direction from one of the main surfaces (111, 109), so that the at least one component is at a predefined distance (d.sub.4, d.sub.5) from the external component (10) when the power module is attached to the external component (10).

A connector attached multi-conductor cable includes a multi-conductor cable and a connector, and the connector includes a circuit board including a first surface, a second surface, and a third surface provided at a tip in a direction of connector insertion to connect the first surface to the second surface. The circuit board includes a first group of pads including a plurality of first pads provided on the first surface and connected to central conductors of the electric wires; a second group of pads including a plurality of second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first surface and the second surface, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided on a side apart from the first group of pads in the second direction with respect to the second group of pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

Daughter card assembly including a circuit board and leading and trailing connectors mounted to the circuit board. The leading and trailing connectors have mating ends that face in different directions along a board plane. The daughter card assembly also includes a support wall that is coupled to the circuit board and extends orthogonal to the circuit board. The support wall has a wall opening therethrough. The trailing connector is positioned on the circuit board such that the mating end substantially aligns with the wall opening. The daughter card assembly also includes a retention shroud that projects from an exterior surface of the support wall. The retention shroud defines a shroud passage that aligns with the wall opening. The shroud and wall openings form a receiving passage for receiving at least one of the trailing connector or a corresponding cable connector that mates with the trailing connector.

Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.

Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

Systems, apparatuses and methods may provide for a memory module that includes a dynamic random access memory (DRAM), a first plurality of contact pads positioned along a first side of the DRAM, a first plurality of L-shaped contacts, wherein each of the first plurality of L-shaped contacts is soldered to one of the first plurality of contact pads, a second plurality of contact pads positioned along a second side of the DRAM, and a second plurality of L-shaped contacts, wherein each of the second plurality of L-shaped contacts is soldered to one of the second plurality of contact pads.