An electronic display where various electrical components may be removed from a housing of the display and serviced or replaced without having to demount the display. The electronic display may include an electronic image-producing assembly in electrical communication with a backplane. Various electrical components (e.g., electronic assemblies) may be removably connected to the backplane using self-guiding electrical connectors. An access opening through a wall of the housing may be provided to facilitate removal of an electrical assembly through the housing while the display remains mounted to a vertical surface.

A flexible printed circuit board (FPCB) assembly for a battery module includes a insulated flexible film and conductor patterns arranged inside the film in a predetermined form, and the conductor patterns transmit an electric signal. The FPCB assembly includes a main FPCB configured to extend in one direction; and a sub FPCB assembled to at least one side of the main FPCB and configured to extend in a direction different from the main FPCB.

Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.

A flexible circuit film includes the following elements: a base film; a first power input terminal, a second power input terminal, a first power output terminal, and a second power output terminal each disposed on the base film; an integrated circuit chip disposed between the first power input terminal and the first power output terminal and overlapping the base film; first power wiring disposed on the base film, connecting the first power input terminal to the first power output terminal, and including a first connection part; and second power wiring disposed on the base film, connecting the second power input terminal to the second power output terminal, and including a second connection part. The first connection part and the second connection part are disposed between the base film and the integrated circuit chip, overlap the integrated circuit chip, and are spaced from each other.

A microchip includes a PCB, a first contact feature positioned along a first area of the PCB, a second contact feature positioned along a second area of the PCB that is disposed opposite the first area, a contact frame including first and second contact members respectively coupled to the first and second contact features for signal communication between the first and second contact features and an external electronic device, and a housing enclosing an interior region of the microchip and carrying the first and second contact members of the contact frame.

An electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate and connecting one side of the front plate to one side of the rear plate, an antenna structure including at least part of the conductive portion, and a printed circuit board disposed in the space and including at least one processor. At least part of the side member is a conductive portion. The conductive portion includes a first conductive pattern, a second conductive pattern disposed at least partially coupled to the first conductive pattern, and a third conductive pattern disposed at least partially coupled to the first conductive pattern and spaced apart from the second conductive pattern. The antenna structure includes a first feeding part electrically connected to a first location of the first conductive pattern, a second feeding part electrically connected to a second location of the first conductive pattern, wherein the second location is closer to the third conductive pattern than the first location, a first ground part electrically connected to a third location between the first location and the second location of the first conductive pattern, a second ground part electrically connected to a fourth location between the second location and the third location of the first conductive pattern, a switch electrically connected to a fifth location between the first location and the third location of the first conductive pattern, a third ground part electrically connected to a sixth location of the second conductive pattern, and a fourth ground part electrically connected to a seventh location of the third conductive pattern.

The present invention provides a speaker box having an upper cover, a lower cover mated with the upper cover to form an accommodation space and a speaker unit accommodated in the accommodation space. The speaker box also includes an elastic piece electrically connected to the speaker unit and a flexible circuit board electrically connected to the elastic piece. One end of the elastic piece is connected to the speaker unit and the other end is bent and extended to the extension part. The flexible circuit board is connected to the elastic piece on the extension part and extends out of the accommodation space. lo The speaker box provided by the present invention can smoothly draw out the flexible circuit board to the position of the feed point, thereby effectively ensuring the communication between the flexible circuit board and the external circuit.

A miniature probe for measuring small voltage signals of a DUT includes a probe body having a flexible substrate and signal transmission lines running a longitudinally, and a first probe connection circuit located at a first end of the probe body and including exposed wires, SMT components coupled between the exposed wires and the signal transmission lines, respectively, and a local mechanical stiffener mounted adjacent the SMT components. The wires are connectable to the DUT for receiving the voltage signals. The probe further includes a second probe connection circuit located at a second end of the probe body, and including transmission line connectors coupled to the signal transmission lines, respectively, and a bent portion of the flexible substrate between the probe body and the transmission line connectors. The bent portion enables the transmission line connectors to exit the probe substantially axially, relative to the longitudinal length of the probe body.

Disclosed embodiments include folded, top-to-bottom interconnects that couple a die side of an integrated-circuit package substrate, to a board as a complement to a ball-grid array for a flip-chip-mounted integrated-circuit die on the die side. The folded, top-to-bottom interconnect is in a molded frame that forms a perimeter around an infield to receive at least one flip-chip IC die. Power, ground and I/O interconnections shunt around the package substrate, and such shunting includes voltage regulation that need not be routed through the package substrate.

Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14), a drain lead (13) and a source contact surface (15). An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.