A device that includes a first board, a second board, and coaxial cable coupled to the first board and the second board. The coaxial cable includes a multi-line coaxial cable configured to provide at least two electrical paths for electrical currents between the first board and the second board. A first plug is coupled to the first board. A second plug is coupled to the second board. The coaxial cable includes a first receptacle and a second receptacle. The first receptacle is configured to couple to the first plug. The second receptacle is configured to couple to the second plug. The coaxial cable is configured to provide (i) a first electrical path for a first electrical current between the first board and the second board, and (ii) a second electrical path for a second electrical current between the first board and the second board.

An imaging module includes an electric cable including a plurality of wirings, an imager having an imaging surface intersecting an axial direction of a distal end of the electric cable, and a flexible wiring board configured to electrically connect the imager and the electric cable. The wiring board includes a plurality of extending portions that extend from at least three portions of a connection portion connected with the imager. At least one wiring pad to which at least one of the plurality of wirings of the electric cable is connected is provided in each of the plurality of extending portions.

A soldering aid for connecting a cable to a printed circuit board includes an electrically insulating body having a first, second and third recesses, and an electrically conductive contact structure coupled thereto. The contact structure is partially embedded in the body to be connected to a cable core therein, and partially protrudes from the body to be connected the printed circuit board. The first recess is conically tapered to receive an end portion of the cable and has first and second sections for non-stripped and stripped portions of the cable end portion, respectively. An end of the second recess adjoins the second section of the first recess to enable optical verification of formation of a connection between the cable core and the contact structure. The third recess is configured to receive and transfer solder to the second section of the first recess to thereby form the connection.

Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.

A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss.

A circuit board assembly has a circuit board and a high-speed cable. The high-speed cable has two signal lines, a ground conductor, an impedance-reducing conductor, and a covering material. The signal lines, the ground conductor, and the impedance-reducing conductor are mounted through the entire high-speed cable. The covering material wraps the signal lines, the ground conductor, and the impedance-reducing conductor, and has a conductive layer and an isolation layer as an inner layer and an outer layer respectively. The conductive layer has multiple loops electrically connected to the ground conductor and the impedance-reducing conductor. Thus, the impedance in the covering material, the ground conductor, and the impedance-reducing conductor is decreased, which prevents from attenuating the signal intensity during transmission at high frequency.

To provide a connected structure of a substrate and an electric wire with high connection reliability even when a carbon nanotube wire with an average diameter of 0.05 mm to 3.00 mm is used as the electric wire. The connected structure of the substrate and the carbon nanotube wire includes a substrate; a carbon nanotube wire made of one or more carbon nanotube aggregates each including a plurality of carbon nanotubes, the carbon nanotube wire having an average diameter of 0.05 mm to 3.00 mm; a conductive fixing member, part of which is provided between the substrate and the carbon nanotube wire; and a conductive member that electrically connects the carbon nanotube wire and the fixing member.

A method and device are provided. The device includes a system component that has a circuit board that includes a cable connection portion. The cable connection portion is disposed on and extends along a mounting surface, and includes board pads disposed on the mounting surface within the cable connection portion. The board pads define corresponding board contact surfaces for electrical coupling with connector pads, and include a board adhesive material disposed on the corresponding board contact surfaces.

Technologies and implementations for a clip to connect coaxial cables onto a printed circuit board assembly (PCBA) is disclosed. The technologies and implementations facilitate improved signal integrity from the cable to various components of the PCBA. Additionally, the technologies and implementations help facilitate management of mechanical variations during connection of the coaxial cable.