An electronic device is provided. The electronic device includes a housing that includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface, a first printed circuit board seated inside the housing, a second printed circuit board seated inside the housing, a plurality of cables configured to electrically connect the first printed circuit board and the second printed circuit board, and at least one cable fixing apparatus coupled to the first printed circuit board or the second printed circuit board to accommodate and fix the plurality of cables. In addition, various embodiments identified through the specification are possible.

A high frequency connector includes a case, a circuit board, a component protecting member and a cable. The circuit board is configured in the case and includes an electronic component and a plurality of solder pads. The component protecting member includes a case body and is configured on the circuit board. One side of the case body has an opening, and a containing space is formed between the opening and the inner face of the case body. A crossing structure is formed by the outer surface of the other side of the case body. When the component protecting member is configured on the circuit board, the component protecting member covers the electronic component in the containing space to maintain the transmission characteristics of the electronic component.

Method for providing an electrical connection, comprising connecting a first cable to a first conducting structure on a printed circuit board, connecting a second cable to a second conducting structure on the printed circuit board, comparing a propagation delay of a first signal path comprising the first cable and the first conducting structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conducting structure on the printed circuit board; and removing conductive material of the first conducting structure and/or of the second conducting structure, in order to modify an electrical length of the first conducting structure and/or of the second conducting structure, to obtain a first conducting path and a second conducting path, in dependence on a result of the comparison, in order to reduce a difference of the propagation delays between the first signal path and the second signal path.

An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.

A connector attached multi-conductor cable includes a multi-conductor cable and a connector that includes a circuit board including first to third surfaces. The circuit board includes first pads provided on the first surface and connected to central conductors of wires; second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first and second surfaces, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided apart from the first pads in the second direction with respect to the second pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

Embodiments may relate an electronic device that includes a first server blade and a second server blade coupled with a chassis. The first and second server blades may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first and second server blades such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof, and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

A cable connector module includes a cable card assembly including a circuit card, cables terminated to the circuit card, and a cable holder coupled to the circuit card and holding the cables relative to the circuit card. The cables include cable conductors electrically connected to corresponding cable contacts of the circuit card. The cable holder holds each of the contacts and includes a connecting tab coupled to the circuit card. The circuit card includes front and rear retaining tabs. The cable connector module includes a connector shell having a cavity that receives the cable card assembly. The connector shell includes a front retainer at the front receiving the front retaining tab to hold the front of the circuit card relative to the connector shell. The connector shell includes a rear retainer at the rear receiving the rear retaining tab to hold the rear of the circuit card relative to the connector shell.

An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.