An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable. The connecting destinations for the electrical insulated wires to the electrode patterns are determined in such a manner that a maximum intersection coefficient denoting either larger one of the respective intersection coefficients of the one end side and the other of the cable is made small.

Embodiments may relate an electronic device that includes a first platform and a second platform coupled with a chassis. The platforms may include respective microelectronic packages. The electronic device may further include a waveguide coupled to the first platform and the second platform such that their respective microelectronic packages are communicatively coupled by the waveguide. Other embodiments may be described or claimed.

A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss.

A multi-line electrical assembly that includes a multi-line cable (14), including a multiplicity of insulated conductive wires (59); and a multi-line electrical plug (16), physically connected to the cable. The plug has a housing (56) and a plurality of spaced-apart printed circuit hoards (PCBs, 48), housed in the housing and having a first end (47) that is connected to the cable and having a second end (46), separated from the first end. Further, the PCBs bear a plurality of conductive traces (50), at least some of the traces being electrically connected to the wires proximal to the first end. The traces terminate proximal to the second end.

A system may include a circuit board comprising a plurality of electrically-conductive layers separated and supported by layers of insulating material laminated together, wherein the plurality of electrically-conductive layers comprises a ground plane and the layers of insulating material comprise a surface layer having one or more openings through which the ground plane is exposed through the one or more openings. The system may also include a plurality of electrically-conductive pads formed on a surface of the surface layer and a cable comprising a first signal conductor mechanically contacted to a first pad of the plurality of electrically-conductive pads and a first drain conductor mechanically contacted to the ground plane through the one or more openings.

An electric wire connection structure is composed of insulated electric wires each including a core and an insulation coating covering the core. The cores of the insulated electric wires are connected to pads provided on a substrate. The insulated electric wires are arranged along a predetermined alignment direction and arranged parallel to each other. The insulation coating is removed at a part in a longitudinal direction of each of the insulated electric wires to expose the core. Exposed portions of the cores are connected to the pads, respectively. Some of the insulated electric wires are configured in such a manner that the core is exposed in an area where the insulation coatings of adjacent ones of the other insulated electric wires in the alignment direction are not removed.

A motherboard including a main circuit board, a first connector, a power circuit board and a second connector. The first connector is disposed on the main circuit board. A periphery of the power circuit board is spaced apart from a periphery of the main circuit board. The second connector is disposed on the power circuit board. The first cable electrically connects the first connector with the second connector.

A cable card assembly includes a circuit card having a substrate including mating pads at a mating end and cable pads at a cable end. The circuit card has a ground plane. Cables are terminated to the circuit card at the cable end each having signal conductors, an insulator surrounding the signal conductors, and a ground conductor surrounding the insulator. Cable shields are terminated to the ground plane providing electrical shielding for the corresponding cables. Each cable shield includes an end wall between first and second side walls to form a cable cavity. The end wall has a connecting portion between the first and second side walls and a shroud portion extending from the connecting portion covering a portion of the ground conductor. The shroud portion is curved to follow a curvature of the ground conductor and extend along opposite sides of the ground conductor.

A low passive intermodulation (PIM) coaxial-to-printed circuit board (PCB) interface and method of constructing the same. According to one aspect, a coaxial-to-PCB interface couples signals between an electrical conductor trace in the PCB and an inner conductor of a coaxial structure having an insulator surrounded by an outer conductor. A metallic cylinder is inserted over the outer conductor of the coaxial structure and positioning the coaxial structure with respect to the PCB so that the outer conductor and insulator of the coaxial structure lie below a lower surface of the PCB. The inner conductor of the coaxial structure is inserted into a via extending from the lower surface of the PCB to an upper surface of the PCB. Solder is deposited in the via to provide an electrically conductive path between the electrical conductor trace of the PCB and the inner conductor of the coaxial structure.

The present invention is directed to a wire comb. The wire comb includes a flat body which includes a first end and a second end. The ends are connected by an arcuate section which has an upper and lower surface. The upper surface of the arcuate section has a wire mount area that includes at least one opening formed in the upper surface with each opening including a shape selected to receive and hold a wire within. A mounting feature extends from at least one of the first end and the second end. The mounting feature is adapted to engage a printed circuit board.