An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

Linking cable connector includes a lead frame held in an interior cavity of a cover. The lead frame includes conductive leads arranged side by side in a row and extending between a first end and an opposite second end of the lead frame. At least some adjacent conductive leads are spaced on a first lead pitch at the first end, and are spaced on a second lead pitch at the second end. The second lead pitch is less than the first lead pitch. The conductive leads engage and electrically connect to corresponding wire conductors of a first cable harness at the first end of the lead frame, and the conductive leads engage and electrically connect to corresponding wire conductors of a second cable harness at the second end of the lead frame such that the leads provide conductive paths between the first and second cable harnesses.

An electronic device is provided. The electronic device includes a housing that includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface, a first printed circuit board seated inside the housing, a second printed circuit board seated inside the housing, a plurality of cables configured to electrically connect the first printed circuit board and the second printed circuit board, and at least one cable fixing apparatus coupled to the first printed circuit board or the second printed circuit board to accommodate and fix the plurality of cables. In addition, various embodiments identified through the specification are possible.

A display device is basically provided that comprises a display, two circuit boards, and a cable. The cable connects the circuit boards together and includes a sheet-form wiring component having a first face and a second face on the opposite side from the first face, a first insulating part that is disposed on the first face, and a shield component that is disposed on the first insulating part and shields electromagnetic waves. The cable has a bent part that is bent to a second face side. The angle α formed by a direction towards one end of the wiring component from the bent part and a direction towards the other end of the wiring component from the bent part is 0°<α<180°.

A connector attached multi-conductor cable includes a multi-conductor cable and a connector, and the connector includes a circuit board including a first surface, a second surface, and a third surface provided at a tip in a direction of connector insertion to connect the first surface to the second surface. The circuit board includes a first group of pads including a plurality of first pads provided on the first surface and connected to central conductors of the electric wires; a second group of pads including a plurality of second pads provided on the first surface, arranged in a first direction parallel to the third surface, and connected to the first pads; a first ground layer provided between the first surface and the second surface, and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided on a side apart from the first group of pads in the second direction with respect to the second group of pads, and connected to the first ground layer. The conductive member is positioned on the first surface side with respect to the first ground layer in a third direction perpendicular to the first surface.

Electrical connectors provide signal connections between electronic devices using electrically-conductive contacts, or electrical contacts. In some applications, a connector including a solid substrate body may facilitate the connection of cables with a complementary connector.

A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.

Various methods and systems are provided for an imaging detector array. In one example, a detector module of the array has a central slit separating a first tile from a second tile of the detector module. An integrated circuit is located along a first side of the first tile and along a first side of the second tile and flex cable coupled to the integrated circuit of the first portion extends through the central slit of the detector module.

A connector module includes a substrate including stacked magnetic layers, a first principal surface, and a second principal surface opposite to the first principal surface, a surface mount connector mounted on mounting electrodes on the first principal surface of the substrate, external mounting electrodes disposed on the second principal surface of the substrate, and inductors inside the substrate and each connected at a first end thereof to a corresponding one of the mounting electrodes and connected at a second end thereof to a corresponding one of the external mounting electrodes.