H05K2201/10363

Printed circuit board for base station antenna

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.

High-frequency module

A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

Semiconductor device and system

An electronic device is disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.

MOTOR DRIVE DEVICE AND METHOD FOR MANUFACTURING SAME
20230066238 · 2023-03-02 ·

Provided are a motor drive device that reduces the likelihood of mounting error during manufacture, and a method for manufacturing the same. The motor drive device is provided with: a substrate; a first mounting region for mounting first circuit component; a second mounting region for mounting a second circuit component; a first pair of connection points for connecting a first connecting wire member, constituting a first path for supplying electric current to the first circuit component, onto the substrate such that at least a part of the first connecting wire member overlaps the second mounting region; and a second pair of connection points for connecting second connecting wire member, constituting a second path for supplying electric current to the second circuit component, onto the substrate such that at least a part of the second connecting wire member overlaps the first mounting region.

High Density Coil Design And Process

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

Surface mount radio frequency crossover device
11469486 · 2022-10-11 · ·

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

Compliant pin surface mount technology pad for rework

Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

Motor vehicle component support and method for the production thereof

The invention relates to a motor vehicle component support, in particular a motor vehicle door lock (1), and to a method for the production thereof. Said motor vehicle component support is equipped with a strip conductor structure (3) composed of several strip conductors (7). According to the invention, the strip conductor structure (3) comprises at least two conductor strip sub-structures (3a, 3b) which are electrically interconnected by means of at least one connecting element (8) which is applied later.

CIRCUIT STRUCTURE
20170367189 · 2017-12-21 ·

A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face thereof; a conductive member fixed to the other face of the substrate; an electronic component that has first terminals and of a plurality of terminals, that are electrically connected to the conductive member, and a second terminal of the plurality of terminals that is electrically connected to the conductive pattern provided on the substrate; and a relay member for electrically connecting the second terminal and the conductive pattern provided on the substrate, at least a portion of the relay member being fixed to the conductive member via an insulating material.

Printed circuit board having improved high speed transmission lines

A printed circuit board assembly comprises a printed circuit board (PCB) defining a mounting end and an opposite contacting end, a row of first pads on the mounting end, a row of second pads on the contacting end, and an edge connector on the contacting end electrically contacted with the second pads, and a high speed line module mounted on a top side of the PCB and including a group of conductive lines, the conductive lines extending parallel to each other over the plane of the PCB, each conductive line having two ends electrically connected to corresponding first and second pads, respectively.