A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

A circuit apparatus includes: a stacked body; and a plurality of terminals. The stacked body includes a plurality of layers. A plurality of holes that extend through the plurality of layers are formed in the stacked body. Each of the plurality of layers includes a connection member that is formed of a conductor. The connection member includes: a plurality of connection portions that are provided at positions corresponding to the plurality of holes; and a joining portion that connects the plurality of connection portions to each other. The plurality of terminals include a plurality of types of terminals that correspond to the plurality of layers. Each of the plurality of types of terminals can be selectively connected to the connection portion of a corresponding one of the plurality of layers by being inserted into a predetermined one of the plurality of holes.

The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.

A display device includes a display panel including a bending area and a non-bending area adjacent to the bending area, a base substrate disposed under the display panel and including a through-hole overlapping the bending area, a conductive part filling the through-hole, a flexible printed circuit board including a first surface connected to the conductive part and second a surface opposite to the first surface, a first film contacting the first surface of the flexible printed circuit board overlapping the non-bending area, and a protection member contacting an upper surface of the first film.

A printed circuit board assembly and an electronic apparatus using the same are provided. The printed circuit board assembly includes a circuit board and a first bridging unit. The circuit board includes a first wiring layer, and the first wiring layer includes a plurality of first ground traces, a plurality of first signal traces, and at least one first ground region. Each of the first signal traces is disposed between one of the first ground traces and the first ground region. The first bridging unit is disposed on the first wiring layer of the circuit board. The first bridging unit extends over, without contacting, at least one of the first signal traces from one of the first ground traces to another one of the first ground traces or the first ground region, so as to form at least one first conductive ground path.

Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.

In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

A printed circuit board assembly includes a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board.

A gas sensor includes a wiring board having an opening, a sensor element disposed within the opening and having a detection section and a heater section, and a plurality of electricity conducting members each of which has a first end portion joined to the wiring board and a second end portion joined to the sensor element and which establish electrical connection between the wiring board and the sensor element. The plurality of electricity conducting members fixedly suspend the sensor element within the opening. At least one of the electricity conducting members is a particular electricity conducting member having a plate-like shape, and the particular electricity conducting member includes at least one bent portion between the second end portion joined to the sensor element and the first end portion joined to the wiring board, the bent portion being bent in a thickness direction of the particular electricity conducting member.

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.