A robust, reliable, and efficient UHD HDR IP client device, such as a set top box, receives content, for example, from a cable service provider so that the content can be displayed to a compatible display device with improved visual effect. The UHD HDR IP client device PCB design layout comprises a PCB. The PCB includes six layers that maximize the efficiency of the UHD HDR IP client device that includes. The six layers with a design layout that maximizes efficiency and routing provides an improved quality of experience for a user for viewing on a display received 4K or higher content.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).

An electronic apparatus includes a printed board and an electroconductive shield member disposed such as to cover a shield area which is a part of a front surface of the printed board. A wiring connecting an inside and an outside of the shield area is disposed on the front surface of the printed board. The shield member has an opening that connects an inside and an outside of the shield member, at a position where the wiring passes through an outer edge of the shield area, and that extends in an extending direction of the wiring. The opening is electrically connected to a conductor disposed on an opposite side of the wiring from the opening, and the opening and the conductor form a waveguide surrounding the wiring.

A backplane connector includes a housing and a number of wafers assembled to the housing. Each wafer includes a number of conductive terminals, an insulating frame and a metal shield. The housing includes an insulating housing and a metal shell fixed to the insulating housing. The insulating housing includes a number of slots for positioning the wafers. The metal shell is provided with a mating surface and a number of terminal receiving grooves. The contact portions of the conductive terminals are exposed in the corresponding terminal receiving grooves. The present disclosure improves the structural strength of the backplane connector and reduces the risk of damage the mating surface due to the push or collision of a mating connector.

An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

An electronic device including a substrate on which an electronic component is mounted according to various embodiments may include: a first electromagnetic interference (EMI) shield configured to shield the electronic component included in a first region of the substrate; and a second EMI shield supported by at least a part of the first EMI shield and configured to shield the electronic component included in a second region of the substrate.

A personal care appliance with a flexible circuit board having a first end portion, a second end portion and a flexible bridge between the first end portion and the second end portion. A first rigid circuit board is mounted to the first end portion of the flexible circuit board. A second rigid circuit board is mounted to the second end portion of the flexible circuit board and folded over the first rigid circuit board. At least one electronic component that emits electromagnetic waves is mounted to the first rigid circuit board. A flexible shield is folded over the at least one electronic component.