A motherboard module is adapted for an M.2 expansion card to configure. The M.2 expansion card includes a connecting end and a fixing end. An edge of the fixing end has a semi-circular hole. The motherboard module includes a motherboard body, a locking member, and an abutting member. The motherboard body includes an expansion card slot, a first fixing hole, and a second fixing hole. The locking member is detachably fixed in the first fixing hole. The abutting member has a first end and a second end. The first end is detachably fixed in the second fixing hole. When the M.2 expansion card is installed on the motherboard module, the abutting member is located between the M.2 expansion card and the motherboard body, and the second end abuts against the M.2 expansion card. An electronic device is further provided.

Methods for mounting a power amplifier (PA) assembly having an extended heat slug (11) are disclosed. According to one aspect, a method includes manufacturing a left side PCB (22a) and a right side PCB (22b). The method further includes sliding the left side PCB and the right side PCB inward (30) to encompass the PA assembly so that one of the left and right side PCB is in a position to contact a drain of the PA (13) and so that the other of the left and right side PCB is in a position to contact a gate of the PA (14).

A mounting clip can be placed and secured over the exterior surfaces of a package of an integrated optical assembly. The mounting clip includes a top panel, end clips that curl and extend down from end edges of the top panel, an interference tab that extends up from the top panel, and cap clips that curl and extend up from the top panel. The mounting clip is dimensioned such that bends in the end clips press and secure against exterior side surfaces of the package of the integrated assembly. Thus, the mounting clip can be secured to the package of the integrated assembly using an interference or friction fit. A cap on a fiber optic cable that extends from the package can be curled around and secured between the interference tab and cap clips of the mounting clip to secure it during surface mounting.

Electrical contacts described herein reduce electromagnetic interference and electrical resistance for circuits that handle high-frequency electrical currents. An electrical contact described herein comprises a base portion. The length of the base portion is greater than the width of the base portion. An indentation in a first side of the base portion is opposite an indentation on a second side of the base portion. The width of the protrusion is less than the width of the base portion. The protrusion is configured to be placed against a second electrical contact to allow an electrical current to flow through the electrical contact. The position of the protrusion relative to the second electrical contact and the geometry of the protrusion can eliminate stubs that cause electromagnetic interference and increase the area of contact between the first electrical contact and the second electrical contact.

Printed circuit boards (PCBs) may include a heat sink configured to draw heat from a surface-mounted component through the PCB toward a side of the PCB opposite a side having the surface-mounted component. The heat sinks may be single piece components that extend at least partially through the PCB. In some embodiments, the PCB may include connectors that interface between the PCB and a heat sink, or possibly other components.

Electrical contacts described herein reduce electromagnetic interference and electrical resistance for circuits that handle high-frequency electrical currents. An electrical contact described herein comprises a base portion. The length of the base portion is greater than the width of the base portion. An indentation in a first side of the base portion is opposite an indentation on a second side of the base portion. The width of the protrusion is less than the width of the base portion. The protrusion is configured to be placed against a second electrical contact to allow an electrical current to flow through the electrical contact. The position of the protrusion relative to the second electrical contact and the geometry of the protrusion can eliminate stubs that cause electromagnetic interference and increase the area of contact between the first electrical contact and the second electrical contact.

The invention which relates to an EMC filter for the suppression of interference signals addresses the problem of specifying a solution with which reworking expenditures of an inverter board are reduced and, additionally, installation space restriction as well as reduction of development and production costs are attained. This problem is resolved thereby that in an EMC filter module at least one core of a choke with a winding is disposed on a first mounting board, that at least one of the capacitors is disposed on the first mounting board, that the first mounting board comprises at least two contact means and that the first mounting board of the EMC filter module is disposed with its contact means on a main board of an inverter and is electrically connected thereto.

A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.

A sensing device includes a printed circuit board (PCB) having a conductive trace. A micro-controller is attached to the conductive trace and data transmission means is connected to the micro-controller. A sensor is embedded within the PCB and is connected to the micro-controller via the conductive trace. The sensor is configured to sense at least one physiological parameter in a patient.

An automotive component assembly comprises an input circuit portion for a sensor and a component portion. The input circuit portion is aligned with the component portion in a desired assembly position. A pocket is at least partially defined by the component portion to receive the input circuit portion and a clamping force retains the input circuit portion between a first layer and a second layer of the component portion forming the pocket. An overmold material is applied to retain the input circuit portion and the component portion to one another.