Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

A coupling device for coupling a plurality of cable units to a component carrier includes a base plate that is flat in at least one plane. A connecting device is disposed on a first side of the base plate and is configured to mechanically couple the base plate to the component carrier. An opening extends through the base plate for each cable end of a plurality of cable ends of the cable units. The opening in each case is disposed on the base plate at a position corresponding to the respective cable unit.

A connection structure between a printed circuit board and a terminal block includes: an insertion portion at one end of the printed circuit board with a pattern disposed thereon; a terminal-block main body including a receiving port that receives the insertion portion; a nut held in the terminal-block main body; and a screw tightened into the nut. The pattern is interposed between the screw and the nut when the insertion portion is inserted into the receiving port.

A method for producing a connection contact for a sensor or an actuator of a vehicle, the method including: providing a printed circuit board having at least one electronic component arranged thereon and having an opening; inserting a contact bushing into the opening; and combined soldering the at least one component to the printed circuit board and the contact bushing to the printed circuit board in one task. Also described are a related circuit board and a vehicle control unit.

The present disclosure provides a testing fixture for holding a device under test (DUT). The testing fixture includes a base, a frame, a recessed portion, a plurality of sets of electrical contacts and a plurality of electrical lines. The frame extends upward along an outer perimeter of an upper surface of the base. The recessed portion is surrounded by the frame and the upper surface of the base, and the DUT is received in the recessed portion. The plurality of sets of electrical contacts are disposed on the recessed portion and arranged in a rotationally symmetrical manner, wherein a plurality of plated through holes of the DUT are in contact with one set of the electrical contacts after the DUT is assembled with the testing fixture.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

An electronic device is provided, which includes a PCB including a first surface and a second surface facing in a direction opposite to the first surface; and an interface terminal positioned at least partially on the first surface of the PCB, The interface terminal includes a shell including a hollow portion extending from a first opening on a first side of the shell to a second opening on a second side of the shell, a terminal structure including a non-conductive plate positioned in the hollow portion and a plurality of terminals positioned on the non-conductive plate, a first bracket that at least partially covers a surface of the shell, and a second bracket that at least partially covers another surface of the shell. The second bracket includes a protrusion protruding with respect to the second surface of the PCB.