A soft neural interface connector apparatus includes a PCB having a two-dimensional array of solder balls, a transparent top board, a cushioning layer on one side of the transparent top board, and a soft neural interface including a flexible and/or stretchable microelectrode array (MEA) through which neural signals are obtained or delivered. The MEA includes a two-dimensional array of contact pads corresponding to the array of solder balls. The PCB, the transparent top board, the cushioning layer, and the MEA are stacked together such that the MEA is between the cushioning layer and the PCB, and the contact pads are aligned with and in electrical contact with associated solder balls. A magnetic connector system having at least one magnetic connector component on the transparent top board is magnetically connected with at least one magnetic connector component on the PCB to press the contact pads and associated solder balls together.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.

A printed circuit board (PCB) is enhanced with an edge stiffener structure. The edge stiffener structure may be fastened to the PCB in a variety of ways, including using solder, adhesive, or removably attaching with snaps. Removably attached edge stiffening structures may be reused. Edge stiffener structures can overlap on one or both surfaces of a PCB. Some edge stiffener structures include extensions that fit into C-clamps and D-clamps.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.

A wiring device includes: a plate having a first surface and a second surface provided above the first surface; a first protrusion provided on the second surface, the first protrusion having a side surface capable of locking a first substrate and a first upper surface including a plurality of first grooves provided parallel to a first direction, the first substrate being insertable in the first direction parallel to the second surface and being removable in a second direction opposite the first direction on the second surface and the first substrate including a terminal on a surface of the first substrate, each of the first grooves capable of accommodating a coating of a wiring including a conductor and the coating provided around the conductor, the first protrusion extending in a third direction intersecting the first direction and the second direction and the third direction being parallel to the second surface; a holder provided on the second surface, the holder including a plurality of connection portions straddling the first substrate inserted, the holder being connected to the second surface to interpose the first substrate, and the holder including a second upper surface including a plurality of second grooves provided parallel to the first direction, each of the second grooves capable of accommodating the conductor exposed from the coating; and a cover provided on the second surface, the cover including a support portion to support the cover so as to be rotatably openable and closable with respect to the plate, and the cover including a second protrusion capable of bringing the conductor into pressure contact with the terminal between the first protrusion and the holder, the conductor being exposed.

A method for producing a connection contact for a sensor or an actuator of a vehicle, the method including: providing a printed circuit board having at least one electronic component arranged thereon and having an opening; inserting a contact bushing into the opening; and combined soldering the at least one component to the printed circuit board and the contact bushing to the printed circuit board in one task. Also described are a related circuit board and a vehicle control unit.

One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.

Aspects of the embodiments include an edge card and methods of making the same. The edge card can include a printed circuit board (PCB) comprising a first end and a second end, the first end comprising a plurality of metal contact fingers configured to interface with an edge connector, and the second end comprising a through-hole configured to mate with a post of a screw, the PCB further comprising an aperture proximate the second end of the PCB. The PCB can also include a thermal conduction element secured to the PCB, the thermal conduction element supporting an integrated circuit package, the integrated circuit package received by the aperture, wherein the thermal conduction element contacts the PCB proximate the through-hole and the thermal conduction element is configured to conduct heat from the integrated circuit towards the second portion of the printed circuit board.