An optical surface-mount device has a silicone lens member and a solderable support connected with the silicone lens member to facilitate solder reflow mounting of the device to a printed circuit board.

A power module includes a printed circuit board (PCB), a magnetic element, primary and secondary winding circuits and a regulator. The magnetic element is disposed on the PCB and has first to fourth sides. The second side is opposite to the first side, the fourth side is opposite to the third side. The primary winding circuit is disposed on the PCB and positioned in a vicinity of the first or second side. The secondary winding circuit is disposed on the first PCB and positioned in a vicinity of the third or fourth side. The regulator includes a switch disposed on the PCB, and coupled to the primary winding circuit. The at least one switch, the primary winding circuit, and the magnetic element are arranged in a first direction in order. A power device is also disclosed herein.

A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.

A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

An electric motor assembly includes a stator, a rotor, a motor housing, a rotatable shaft, a radial fan, and an air scoop. The motor housing at least partly houses the stator and rotor and presents an exterior motor surface. The rotatable shaft is associated with the rotor for rotational movement therewith, with the rotatable shaft extending along a rotational axis. The radial fan is mounted on the rotatable shaft exteriorly of the motor housing and is rotatable with the shaft to direct airflow in a radially outward direction. The air scoop extends radially outwardly relative to the radial fan and axially to receive radial airflow from the radial fan and turn the airflow axially to flow along the exterior motor surface. The air scoop includes spaced apart axially extending airflow vanes to guide the airflow as the airflow is turned axially.

An electrical connector having a detachable interface and a permanent interface is supported by connecting the permanent interface to a circuit-board. A first loom end (303) and a second loom end (305) are connected to the circuit board and an over-moulding (404) is applied to cover the permanent interface, the first loom end and the second loom end. The detachable interface is located through an orifice in an item of clothing (410) and the over-moulding is secured to an internal surface of an item of clothing by a first side flange (404) and a second side flange (405).

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

A keyboard device includes a substrate, a connection hook, a keycap, and a connecting member. The substrate has a top surface including an assembly area. The connection hook is disposed on the assembly area and includes a fixed seat fixed on the substrate, a standing portion, and a reinforcement block. The standing portion is extending from the fixed seat and extending in a direction away from the fixed seat. A hook portion is laterally extending from a top end of the standing portion, the hook portion has a bottom edge. The reinforcement block is connected to the standing portion and the bottom edge. The keycap is disposed on the assembly area. The connecting member is connected between the keycap and the assembly area. The connecting member includes a shaft slidably pivoted at the bottom edge. An inner side of the shaft includes an avoidance groove corresponding to the reinforcement block.

A keyboard device includes a substrate, a membrane circuit board, a flexible printed circuit board, a first fixing board, and a second fixing board. The substrate includes a top surface, a bottom surface, and a side edge. The substrate further includes an offset protrusion protruding from the top surface and forms a recessed area on the bottom surface. The membrane circuit board is disposed on the top surface. The membrane circuit board includes an outlet area correspondingly disposed on the offset protrusion. The flexible printed circuit board is disposed on the bottom surface. The flexible printed circuit board includes a fixed portion, a folded portion, and an electrical connection end. The fixed portion is received in the recessed area. The first fixing board is correspondingly disposed on the offset protrusion. The second fixing board is correspondingly received in the recessed area and assembled with the first fixing board.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.