Patent classifications
H05K2201/10401
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A circuit board includes a plurality of circuit board layers arranged one on top of the other, wherein through-holes are integrated in the circuit board, wherein the through-holes are configured to receive metal screws that screw the circuit board to a heat sink. Insulating sleeves made of an insulating material are integrated into the circuit board, wherein the through-holes are formed in the circuit board in the region of the insulating sleeves.
Apparatus, system, and method for implementing multipurpose screw holes in circuit packaging for mobile devices
A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
Print media with inductive secondary
An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.
Forming Connections to Flexible Interconnect Circuits
Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.
Apparatus for mounting a printed circuit board
A circuit board mounting arrangement is provided including a circuit board and a press fit mounting bushing including a cylindrical inner piece and an outer piece secured to the inner piece. The outer piece has a plurality of radially projecting, deformable elements and the circuit board has a cylindrical opening having a diameter less than an outer diameter of the radially projecting deformable elements. The deformable elements deform when the mounting bushing is pushed into the cylindrical opening of the circuit board so as to hold the mounting bushing to the circuit board. The circuit board and press fit bushing are then overmolded.
Light-emitting device
A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.
CONDUCTIVE STIFFENER, METHOD OF MAKING A CONDUCTIVE STIFFENER, AND CONDUCTIVE ADHESIVE AND ENCAPSULATION LAYERS
A wearable device includes a flexible printed circuit board and one or more conductive stiffeners. The conductive stiffeners include a conductive surface that can be electrically or thermally connected to contact pads on the flexible printed circuit board. The wearable device can further include an adhesive layer or an encapsulation layer. The adhesive layer and the encapsulation layer can include conductive portions surrounded by non-conductive portions. The conductive portions can be aligned with the conductive stiffeners and together transmit electrical and/or thermal energy to the contact pads of the flexible printed circuit board.
Heat dissipation structure of SMD LED
A heat dissipation structure of an SMD LED includes a substrate, an SMD LED and at least one engaging member. A plurality of conductive copper foils is covered on an upper end face of the substrate. Two electrodes are provided on a lower surface of the SMD LED and are respectively connected to two copper foils on the upper end face. An engaging hole extends through one of the copper foils adjacent the SMD LED and through the substrate. The engaging member is made of high thermal conductive metal and is engaged in the engaging hole to combine the copper foil and the substrate. Accordingly, heat generated by the SMD LED can be directly transferred to an exposed lower end face of the substrate through the engaging member for more heat dissipation and less luminance decrease of the SMD LED.
Conductive band for biosensing garments
Embodiments described herein relate generally to wearable electronic biosensing garments. In some embodiments, an apparatus comprises a biosensing garment and a plurality of electrical connectors that are mechanically fastened to the biosensing garment. A plurality of printed electrodes is disposed on the biosensing garment, each being electrically coupled, via a corresponding conductive pathway, to a corresponding one of the plurality of electrical connectors. The apparatus can further include an elongate member including a conductive member that is coupled to a plurality of elastic members in a curved pattern and that is configured to change from a first configuration to a second configuration as the elongate member stretches. The change from the first configuration to the second configuration can result in a change of inductance of the conductive member.
CONDUCTIVE BAND FOR BIOSENSING GARMENTS
Embodiments described herein relate generally to wearable electronic biosensing garments. In some embodiments, an apparatus comprises a biosensing garment and a plurality of electrical connectors that are mechanically fastened to the biosensing garment. A plurality of printed electrodes is disposed on the biosensing garment, each being electrically coupled, via a corresponding conductive pathway, to a corresponding one of the plurality of electrical connectors. The apparatus can further include an elongate member including a conductive member that is coupled to a plurality of elastic members in a curved pattern and that is configured to change from a first configuration to a second configuration as the elongate member stretches. The change from the first configuration to the second configuration can result in a change of inductance of the conductive member.