The power semiconductor module includes a power semiconductor assembly and a heat transfer member. The power semiconductor assembly includes a circuit board and a case. The circuit board includes an insulating substrate. The second attachment surface to which the heat transfer member is attached is recessed from the first attachment surface to which the heat sink is attached. The maximum recessed distance of the second attachment surface from the first attachment surface is smaller than the original thickness of the heat transfer member, and is greater than the lower limit thickness of the heat transfer member.

An electric motor includes a rotor assembly and a stator assembly. The stator assembly includes a plurality of teeth, a plurality of coils supported about the plurality of teeth, and a conductive terminal electrically connected to at least one coil of the plurality of coils. The conductive terminal includes a lead portion. The electric motor also includes a printed circuit board coupled to the stator assembly and electrically connected to the lead portion. The electric motor further includes a solder cup supported on the lead portion between the printed circuit board and the stator assembly. The solder cup includes a wide end facing toward the printed circuit board, and a narrow end opposite the wide end.

A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.

A reinforcement structure is provided for reinforcing a thumbscrew that fastens a printed circuit board (PCB) assembly to a metal carrier. The reinforcement structure may include a cap configured to engage with the thumbscrew. The cap may include a hollow cylindrical body having an outer sidewall and outer gears on the outer sidewall. The reinforcement structure may also include a base configured to attach to the PCB assembly. The base may include a planar plate having two or more outer edges and an inner hole. The base may also include an inner sidewall extending from the inner hole downward perpendicularly from the planar plate. The base may also include internal gears on an upper portion of the inner sidewall. The outer gears of the cap are coupled to the internal gears of the base to transfer the torque from the thumbscrew to the cap and to the base and then to nearby PCB components.

An electronic control unit includes a casing and a cover which are mutually bonded. A drive circuit board which drives a motor unit is fixed to the cover and, on the other hand, a control circuit board which controls the drive circuit board is fixed to the casing. An electrical connector which supplies an electric power to each board and a motor unit is attached on an opening section of the casing. First power supply terminals of this electrical connector and the motor unit and second power supply terminals of the drive circuit board are directly electrically connected by a bonding of both of casing and the cover.

The present invention relates to a base fastener which is disposed corresponding to a pair of arc holes on a base. The base fastener comprises a body. The body has a first side, a second side, and a throughhole. The throughhole penetrates through the first side and the second side. A first post and a second post protrude from the second side beside the throughhole. The first post, the second post, and the pair of arc holes are disposed correspondingly and rotatably connected to each other to be assembled with the base firmly.

A system-in-package cellular assembly is disclosed. The assembly may include a main board including a multi-layer printed circuit board. The main board may include one or more through holes and be detachably connectable to an end-product via the one or more through holes and one or more connecting members. The main board may be reversibly, electrically couplable to the end-product via the one or more through holes and the one or more connecting members. The assembly may include an add-on board including one or more through holes and be detachably connectable to the main board via one or more connectors. The add-on board may be reversibly, electrically couplable to the main board via one or more main board surface mount connectors and one or more add-on board surface mount connectors. The add-on board may include at least one of one or more sensors or one or more sensor through holes.

A heat dissipating assembly of M.2 expansion card is adapted to fix an M.2 expansion card to a motherboard, and includes a heat dissipating body having a first end and a locking member. The heat dissipating body includes a fixed portion located at the first end and at least one screw hole, and the heat dissipating body is adapted to be fixed to the motherboard through the fixed portion. The locking member is detachably disposed on the at least one screw hole, and the locking member is adapted to fix the M.2 expansion card to the heat dissipating body.

Provided is a circuit board supporting structure capable of easily detaching a circuit board on a base. The circuit board supporting structure is configured to support a circuit board on a base, in which the base has a concave portion formed in a placement surface of the circuit board, and a rotational operation member configured to be rotatably accommodated in the concave portion and extend and retract in a direction perpendicular to the placement surface by a rotational operation, in which the circuit board has a through hole formed at a position corresponding to the concave portion, in which the rotational operation member has a reference surface formed approximately in parallel with the placement surface, and an operation portion formed on a rotational axis of the rotational operation member so as to be exposed from the through hole.

An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.