An integrated heat exchanger has a heat exchanger within a circuit board. The circuit board can be a PCB having one or more electronic components coupled to its top-side surface. The conductive layers of the PCB include a first sub-set of electrically conductive interconnects and as second sub-set of electrically conductive interconnects. The first sub-set of conductive layers are electrically connected to each other and to the one or more electronic components. The second sub-set of conductive layers are electrically isolated from the first sub-set of conductive layers by intervening non-conductive layers such as prepreg. In this manner, the heat exchanger is electrically isolated from the one or more electronic components. The second sub-set of conductive layers include a dedicated top-side conductive layer to which a baseplate can be attached. The baseplate is also attached to the one or more electronic components via an electrically non-conductive gap filler.

A circuit board heat dissipation system includes circuit board unit that includes a motherboard and a daughterboard, a base seat, and a fastening unit that includes a plurality of first and second fastening components. Each first fastening component extends through the daughterboard and is engaged with the base seat. Each second fastening component includes a long fastener that extends through the base seat and the daughterboard and that is engaged with the motherboard, and a flat washer and a resilient member that are sleeved on the long fastener. The resilient member is disposed between a head portion of the long fastener and the flat washer for biasing the base seat and the daughterboard against the motherboard.

An M.2 fastening system has an M.2 riser card with two module-receiving sides and a plurality of adjustment positions. The M.2 fastening system further has a pair of M.2 fasteners mounted respectively on the module-receiving sides. Each M.2 fastener has a main body defined by a top surface and a bottom surface; a module attachment extending from the top surface; and a hook extending from the bottom surface along a lateral side of the main body. The hook of one of the M.2 fasteners is received through an attachment aperture of an adjustment position. The hook is pressed-fit over the top surface of the main body of another M.2 fastener. The hook secures the M.2 riser card between the pair of M.2 fasteners in a tool-less manner.

An apparatus, system and method capable of providing a high precision connection between a plurality of pins of a C form factor pluggable (CFP) and a connection pad of a printed circuit board (PCB). The apparatus, system and method include: a connector mask suitable to receive therein a body of the CFP; a ruler suitable to receive therein the connector mask, and sized and shaped for direct physical associated with the PCB about the connection pad; and an adjustment mechanism at least partially passing through the ruler for contacting at least the connector mask and capable of adjusting the position of the pins in relation to the connection pad.

The present disclosure, in various aspects, describes technologies and techniques for a controller of a data storage device to mitigate temperature increases in the data storage device. In one example, the controller receives a command for a memory operation, analyzes the command to determine whether execution of the command with thermal throttling would have a negative impact on a user experience, and activates, if performing the thermal throttling would have the negative impact on the user experience, one or more thermoelectric cooler (TEC) devices while refraining from performing the thermal throttling. In another example, the controller monitors a temperature of one or more regions of the data storage device, determines whether the temperature exceeds a threshold temperature, activates one or more TEC devices to mitigate the temperature when the temperature exceeds the threshold temperature, and deactivates any activated TEC devices when the temperature no longer exceeds the threshold temperature.

The LED luminaire is constructed with an LED/driver printed circuit board mounted directly on a floor of the heat sink assembly. By mounting the LED/driver printed circuit board directly in and on the heat sink assembly, the heat imposed on the LED/driver printed circuit board during use in a canopy hood over a cooking surface is transferred directly to the heat sink assembly for dissipation.

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a space holding member. The second printed circuit board includes a first rigid substrate region, spaced apart from and opposed to the first printed circuit board, and a flexible substrate region, extended from one side of the first rigid substrate region to be connected to the first printed circuit board. The space holding member includes a first member, disposed between the first printed circuit board and the second printed circuit board to maintain a space therebetween, and a second member configured to fix the first printed circuit board or the second printed circuit board on the first member.

An electrical connector includes a body having an opening running vertically therethrough. The opening has a first side wall. The body further includes a recess concavely formed on the first side wall. At least one conductive terminal includes a base fixed to the body, a conducting portion connected to the base to be electrically connected to a second mating member, and an elastic arm connected to the base in the recess. The elastic arm includes a connecting section located in the recess and an extending section connected to the connecting section. Both the conducting portion and the extending section protrude from the first side wall toward the opening. The extending section has a contact portion electrically connected to a first mating member. In a top view, a first central line of the extending section and a second central line of the conducting portion are parallel to each other.

The invention relates to an EMC filter for a control device. The filter includes a multilayer circuit carrier comprising electrically conductive layers, in particular copper layers, and electrically insulating circuit board layers. According to the invention, the circuit carrier of the aforementioned type forms at least two filter capacitors, wherein in each case the filter capacitors are formed by electrically conductive layers that are formed in the circuit carrier and lie across from one another and/or extend parallel at a distance from each other.

The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate; an upper ceramic substrate which is disposed spaced apart from the upper portion of the lower ceramic substrate, and on the lower surface of which a semiconductor chip is mounted; spacers each having one end bonded to the lower ceramic substrate and the other end bonded to the upper ceramic substrate; first bonding layers each bonding the one end of each spacer to the lower ceramic substrate; and second bonding layers each bonding the other end of each spacer to the upper ceramic substrate. The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.