A connecting device (10) for connecting a printed circuit board (14) to a busbar (12) is provided, having: a printed circuit board (14) and a busbar connecting element (16) which has a base body (18) with a first side (20) for bearing on the busbar (12), and a second side (22), situated opposite the first side (20), for contacting the printed circuit board (14), wherein the busbar connecting element (16) moreover has at least two anti-twist sections (24) which are connected to the base body (18) on the second side (22) of the base body (18), extend from the second side (22) of the base body (18) into a respective recess (26) formed in the printed circuit board (14), and engage in the respective recess (26) in such a way that the busbar connecting element (16) and the printed circuit board (14) are held non-rotatably relative to each other.

An electronic module, more particularly a control module or sensor module for a motor vehicle transmission, has a circuit board having a first side and a second side facing away from the first side, electronic components arranged on the first side, and a casting compound arranged on the first side. The casting compound covers the electronic components. The circuit board has a through-hole connecting the first side to the second side. A sensor element covering the through-hole is arranged on the first side of the circuit board.

A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.

A pilot device for a hydraulic directional valve includes a displacement sensor, a pilot valve, an actuating device, a coil assembly, and a circuit board. The displacement sensor has a sensor axis and the pilot valve has a valve axis. The valve axis and the sensor axis are arranged substantially parallel to one another so as to lie in a reference plane. The actuating device and the coil assembly are arranged adjacent to one another. The circuit board is arranged parallel to the reference plane. In each case, to establish an electrical contact, the coil assembly, the actuating device, and an electrical plug connection are either soldered directly to the circuit board or are in breakable electrical contact with a respectively associated, rigid contact assembly. The contact assembly is soldered directly to the circuit board.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

A structure and method for retaining fastening element solder are introduced. The structure includes a fastening element which has a solderable surface and a fastening portion or a hole portion. One end of the hole portion or the fastening portion has a retaining portion. During a soldering heating process, solder flows into or enters the retaining portion to cool down and solidify. The solidified solder is retained in the retaining portion. The fastening element is firmly coupled to a first object because of coordination between the solderable surface and the retaining portion, and the second object is coupled to or removed from the fastening element because of coordination between the fastening portion and the hole portion, so as to couple together and separate the first and second objects repeatedly and quickly.

A cooling device is provided having a heat source arranged on a support element, the support element arranged on a rigid heat barrier element and the heat barrier element arranged on a housing such that the support element, the heat barrier element and the housing form a mechanically rigid unit, the heat barrier element having a low heat conductivity, wherein a heat conducting element, arranged between the housing and the support element, bears against a first surface of the support element with a second surface and faces a fourth surface of the housing with a third surface, wherein the heat conducting element has a high heat conductivity, the second surface is at an angle to the third surface, and the heat conducting element is formed separately from the support element and the housing.

In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.