A fixing device includes a circuit board, an insertion slot, and a fixing bracket. The circuit board has a peripheral recess, and the insertion slot is disposed on the circuit board. The fixing bracket is fixed in the peripheral recess, and the fixing bracket has a board, two lateral arms, and two guiding rails. The two lateral arms are connected to two corresponding sides of the board, and the two lateral arms are integrally formed from the board. In addition, the two guiding rails are respectively disposed at the two lateral arms, in which the two guiding rails extend towards the insertion slot.

A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

A mechanism for electrically contacting a printed circuit board to a battery cell composite system comprises a printed circuit board, at least one bimetallic element which is fastened to the printed circuit board, at least one cell connector for connecting the battery cell composite system to the printed circuit board, wherein the cell connector contacts the at least one bimetallic element with a connecting element, and a fastening element for fastening the connecting element to the at least one bimetallic element.

An interface card assembly adapted for fixing an M.2 interface card to a circuit board body with an M.2 connector is provided. The M.2 interface card includes a connecting end and an end. The interface card assembly includes a heat dissipation plate and a fastener. The heat dissipation plate is disposed at a position adjacent to the M.2 connector, and the heat dissipation plate includes a hole. The fastener is detachably disposed in the hole. The fastener includes a main body and a cantilever, and a clamping part is disposed between the main body and the cantilever. When the M.2 interface card is inserted into the M.2 connector through the connecting end, the fastener moves relative to the heat dissipation plate at the end, so that the M.2 interface card extends into the clamping part and is clamped between the main body and the cantilever.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

A circuit board, comprising a connector, screw holes and first ground, wherein first ground terminals of the connector and the screw holes are respectively connected to the first ground, so as to carry out electrostatic discharge by means of the first ground; and the first ground is isolated from ground wires on the circuit board.

A screw boss assembly, including: a plastic substrate, including: a bottom surface including a first channel; an indented surface; a sidewall surface connecting the bottom surface and the indented surface, the sidewall surface including second channels, each of the second channels connected to the first channel; a metal insert, including: a first contacting member; second contacting member; connecting members connecting the first contacting member to the second contacting member; wherein the metal insert is coupled with the plastic substrate such that the first contacting member is positioned within the first channel and the connecting members are positioned within respective second channels.

A module type sensor includes a casing including a casing upper surface, a first casing side surface which is bent downward from the casing upper surface and has a lower end upwardly separated from a path through which a transmission line passes, and a second casing side surface which is bent downward from the casing upper surface and has a fixing bracket extending by being outwardly bent; a body unit fixedly installed inside the casing, formed of an insulator, supported by the printed circuit board at a lower end, and having, at a center, an opening which is open toward the transmission line; and a sensing substrate unit fixedly installed on an upper portion of the body unit, and including a voltage sensing circuit which is capacitively coupled to the transmission line exposed through the opening and a current sensing circuit which is inductively coupled to the transmission line.

This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

A wearable device (100) includes a body (1) and a detection electrode (21). The body (1) includes an electrocardiosignal collection circuit (11), and an inner electrode (12) and an outer electrode (13) that are electrically connected to the electrocardiosignal collection circuit (11). The inner electrode (12) is configured to collect an electric potential signal of a first wearing position (200), and the outer electrode (13) is configured to collect an electric potential signal of a non-wearing position (300). The detection electrode (21) can move relative to the body (1), and the detection electrode (21) is configured to electrically connect to the electrocardiosignal collection circuit (11) and collect an electric potential signal of a second wearing position (400). The non-wearing position (300) and the second wearing position (400) are different from the first wearing position (200). The wearable device (100) can measure electrocardiosignal data in time.