A circuit structure includes an electronic component, a circuit board having a conductive path, the electronic component being mounted on the circuit board, a heat dissipation member on top of which the circuit board is placed and which dissipates heat of the circuit board, a sheet-like spacer sheet provided in a predetermined region between the circuit board and the heat dissipation member, and a bonding portion for bonding the circuit board and the heat dissipation member to each other, the bonding portion having adhesive properties or tackiness and being provided in a region between the circuit board and the heat dissipation member where the spacer sheet is not provided.

An optical communication module includes a module board housed in a casing, a VCSEL and a driving IC mounted on a mounting surface of the module board, a lens holder mounted on the mounting surface of the module board, a lens block held by the lens holder, a plurality of thermal vias passing through the module board, and a first fixing screw and a second fixing screw passing through the module board to be screwed into the casing so as to press a back surface of the module board against a bottom surface of the casing, and the first fixing screw and the second fixing screw are each arranged in a region between the plug connector and the lens holder and on either outer side of the lens holder.

An electronic device has a control board having a plurality of wiring layers, a metal-made housing supporting the control board, and a fixing screw for fixing the control board to the housing through a washer. The control board includes a through hole penetrating from a third surface to a fourth surface, a through electrode formed inside the through hole, and a power system GND pattern formed on any wiring layer of the wiring layers. The power system GND pattern and the housing are electrically coupled through the through electrode, the washer, and the fixing screw.

A connection structure, of a short bar forming a conductive path and a land on a printed circuit board, in which the short bar includes a plate portion having a flat plate shape and a protrusion protruding in a stepped shape from a surface of the plate portion, the protrusion is threadably fastened to the printed circuit board by a screw inserted into a land-side through hole formed through the land, from an opposite side of the printed circuit board with respect to the protrusion, in a state where a flat surface portion formed, at a position spaced apart from the surface of the plate portion, on an outer surface of the protrusion is in close contact with the land.

According to certain embodiments, an electronic device comprises a first electrical structure disposed in an internal space of the electronic device; and a flexible printed circuit board (FPCB) comprising a first fastening area and an extension area extended from the first fastening area, the first fastening area electrically connected to the first electrical structure, wherein the FPCB further comprises: a dielectric substrate comprising a first surface and a second surface facing in a direction opposite to that of the first surface and facing the first electrical structure; a first conductive layer disposed on the first surface of the dielectric substrate; and a first protective layer stacked on the first conductive layer, in the extension area and terminating in the first fastening area; wherein the first fastening area comprises a screw through hole for screw fastening, and at least one conductive via disposed at a periphery of the screw through hole extending from the dielectric substrate to the first conductive layer.

Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.

An electronic assembly includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of stiffening members coupled to the substrate. The substrate further includes a plurality of substrate interconnects. The electronic assembly further includes a plurality of semiconductor dies mounted on the first surface of the substrate. The plurality of semiconductor dies are electrically connected to each other via the plurality of substrate interconnects. The electronic assembly further includes a plurality of power supply modules mounted on the second surface of the substrate. Each power supply module is disposed opposite to a respective semiconductor die.

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.