A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof.

A circuit board includes a circuit board main body including a first through hole and a second through hole, a first inlay member inserted into the first through hole, and a second inlay member inserted into the second through hole. A first end surface of the first inlay member includes a first end portion on the side of the second inlay member, a second end portion on the opposite side of the second inlay member, a first area including the first end portion, and a second area including the second end portion. A first end surface of the second inlay member includes a third end portion on the side of the first inlay member, a fourth end portion on the opposite side of the first inlay member, a third area including the third end portion, and a fourth area including the fourth end portion. The circuit board further includes a first resist provided in the second area, and a second resist provided in the fourth area.

A semiconductor device module includes a package carrier having an opening, wherein in the opening there is disposed a semiconductor package including a semiconductor die, an encapsulant, and first vertical contacts, wherein the encapsulant at least partially covers the semiconductor die, and the first vertical contacts are connected to the semiconductor die and extend at least partially through the encapsulant, and a first outer metallic contact layer electrically connected to the first vertical contacts.

An axial field rotary energy device with a PCB stator having interleaved PCBs is disclosed. The device can include rotors that have magnets and an axis of rotation. A stator assembly can be located axially between the rotors to operate electrical phases. The stator assembly can include PCB panels. Each PCB panel can have layers, and each PCB panel can be designated to one of the electrical phases. Each electrical phase of the stator assembly can be provided by a plurality of the PCB panels. In addition, the PCB panels for each electrical phase can be axially spaced apart from and intermingled with each other.

A substrate is described with a thermal dissipation structure sintered to thermal vias. In one example, a microelectronic module includes a recess between first and second substrate surfaces. One or more thermal vias extend between the first substrate surface and the interior recess surface, wherein each of the thermal vias has an interior end exposed at the interior recess surface. A sintered metal layer is in the recess and in physical contact with the interior end of the thermal vias and a thermal dissipation structure is in the recess over the sintered metal layer. The thermal dissipation structure is attached to the substrate within the recess by the sintered metal layer, and the thermal dissipation structure is thermally coupled to the thermal vias through the sintered metal layer.

A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.

An integrated circuit printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.

Embodiments for a circuit board comprising a plurality of electrically conductive layers and a plurality of electrically non-conductive layers in a laminated stack are provided. The laminated stack defines a front face and a back face. A thermal conductive heat body extends from a die bond pad on the front face to an electrically conductive layer on the back face. The die bond pad is configured for a bare die to be mounted thereon. A bonding agent disposed around the thermal conductive heat body adhering the thermal conductive heat body to walls of an opening of the laminated stack and at least one of the plurality of electrically non-conductive layers are a monolithic structure. A plurality of wire bond pads on the front face adjacent to the die bond pad have a surface finish material thereon. The surface finish material is configured for wire bonding thereto.