A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

A circuit board structure includes a circuit board, at least a through hole, and at least a heat dissipating structure. The circuit board has two opposite surfaces. A metal layer is disposed on each of the opposite surfaces of the circuit board. The through hole is disposed in the circuit board, and the through hole penetrates through the circuit board. The heat dissipating structure is disposed in the through hole. The heat dissipating structure includes a first metal block and a second metal block. The first metal block and the second metal block are joined together in the through hole and have an interface.

A module board of an embodiment includes a printed board having a through-hole, a semiconductor device mounted on the printed board so as to cover the through-hole, and a heat conductive polygonal column included in the through-hole. The semiconductor device includes a ground terminal or a power supply terminal, the polygonal column is supported by the through-hole at the corners of the polygonal column, and the polygonal column is connected to the ground terminal or the power supply terminal.

In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.

An appliance (10) to heat a liquid, the appliance (10) including: a hollow body (16) providing a chamber (23) to receive the liquid, the body (16) having a bottom wall (17) and a side wall (18) extending upwardly from the bottom wall (17) so as to surround the chamber (23); an electrical resistance heater (27) fixed to the body (16) and to which electric power is delivered so that the heater (27) has a raised temperature to heat the liquid contained in the chamber (23); a switch (29), adjacent the heater (27), that receives electric power and delivers electric power to the heater (27), the switch (29) being mounted in the body (16) and located so that heat generated by the switch (29) can be delivered to the liquid via conduction; and wherein the switch (29) is mounted on the body (16) to inhibit heat transfer by conduction between the heater (27) and switch (29).

A circuit device 1 includes a circuit board, an inductor mounted on the circuit board, and a heat dissipation member to which the circuit board and the inductor are assembled. The inductor includes a case main body, and mounting pieces extending from the case main body in parallel with the circuit board. A heat dissipation member includes a main plate portion disposed along a heat dissipation surface on the opposite side of a mounting surface on which the inductor is mounted in the circuit board, and support post portions extending from the main plate portion and penetrating the circuit board and the mounting pieces . The circuit board and the mounting pieces are fixed to the support post portions by an adhesive.

A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.

A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.