A microwave generator for a microwave device includes a single component carrier for control components and power components, which includes a continuous carrier material. Two power regions and one control region are provided on the component carrier. In the control region, electrically functional components are arranged on both flat sides of the component carrier, while in the power regions, electrically functional components with at least one power switch are arranged only on an upper flat side, heat sinks being arranged on the lower flat side. An RF substrate is provided in regions on the upper flat side of the power region.

The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.

An electronic element mounting substrate includes a substrate in a quadrangular shape, including a first main surface and a second main surface opposite to the first main surface, and heat dissipators arrayed and embedded in the substrate, made of a carbon material, and including a third main surface located on the first main surface side in a thickness direction and a fourth main surface opposite to the third main surface. The heat dissipators have, in a plan perspective view, greater heat conduction in a direction perpendicular to a direction in which the heat dissipators are arrayed than heat conduction in the direction in which the heat dissipators are arrayed.

A voltage regulator module includes a first circuit board assembly and a signal communication part. The first circuit board assembly includes a plurality of first conduction pads. The signal communication part is arranged on the first circuit board assembly. The signal communication part includes a conduction circuit board with a plurality of conduction fingers and a plurality of surface pins. The plurality of conduction fingers are formed on at least one lateral side of the conduction circuit board. The plurality of surface pins are electroplated on a top side and a bottom side of the conduction circuit board. A first end of each conduction finger is contacted with the corresponding surface pin on the top side. A second end of each conduction finger is contacted with the corresponding surface pin on the bottom side. The signal communication part is fixed on and electrically connected with the first circuit board assembly.

A printed circuit board includes a substrate and at least one heat generating electronic component mounted on the substrate. At least one ceramic heat conducting member is embedded into the printed circuit board at positions corresponding to the at least one heat generating electronic component. Side surfaces of the ceramic heat conducting member in contact with the printed circuit board are rough surfaces. Heat dissipation effect of the motor is improved.

A circuit board includes a flexible wiring board with a reinforcing member. The flexible wiring board has a first, second and third sections. The reinforcing member is embedded in a cavity in the first section of the wiring board, and is sandwiched by a pair of resin layers provided below and above. A pair of wiring layers are disposed on the pair of the resin layers, respectively. The metal reinforcing member has either a plate shape or a frame shape. The first section of the wiring board is positioned closer to one of the wiring layers than to another of the wiring layers in a vertical direction.

A heat dissipation substrate is disclosed including a base substrate having a first surface and a second surface, an electrically conductive path formed on the first surface, a through-hole penetrating from the first surface to the second surface, a heat dissipation member that is inserted into the through-hole and at least a part of which projects from the first surface, a thermally conductive resin constituent, covering a side surface of the heat dissipation member, that is present, without space, between an inner peripheral surface of the through-hole and an outer peripheral surface of the heat dissipation member surrounded by the inner peripheral surface, and a metal layer covering the heat dissipation member projecting from the first surface, in which an outer surface of the metal layer and an outer surface of the electrically conductive path are disposed on substantially the same plane.

An assembly for controlling the temperature of a device includes: a heat sink configured to be maintained at a temperature below a desired set point temperature; a heater element having a surface configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.

A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.

A pin assembly is provided for a plated via of a circuit board. The pin assembly includes a pin sized for insertion into the plated via, and a plurality of expandable elements affixed to the pin. A conductive coating is disposed over the pin and over the plurality of expandable elements. With the pin assembly inserted into the plated via, one or more expandable elements of the plurality of expandable elements can be expanded within the plated via to enhance contact of the pin assembly to a wall of the plated via.