A metal pallet is integrated within a circuit board using a process similar to a multilayer PCB, which integrates the metal pallet into the circuit board at the same time as the supporting layers are fabricated. The use of B-stage material provides a bonding mechanism for the metal pallet to be embedded within the circuit board, creating a cohesive integrated part. Embedding the pallet during the fabrication process, pre-lamination, generates a more robust construction and connection not impacted by post fabrication process in assembly. After assembly the circuit board with embedded metal pallet can be mounted directly on a heat sink, cool ribbon or other feature required to help remove heat. The planar back side surface provides a more robust mounting of the metal pallet than a post fabricated assembly as used in conventional techniques.

A chip packaging includes a substrate, a first chip, a molding material, a first circuit, and a second circuit. The substrate includes a bottom surface, a first top surface disposed above the bottom surface with a first height, and a second top surface disposed above the bottom surface with a second height. The first height is smaller than the second height. The first chip is disposed on the first top surface. The molding material is disposed on the substrate and covers the first chip. The first and second circuits are disposed on the molding material, and are respectively and electrically connected to the first chip and the second top surface of the substrate. The substrate is made of copper material with huge area and has the properties of high current withstand capacity and high thermal efficiency. The second top surface protects the first chip from damage.

High thermal performance microelectronic modules containing sinter-bonded heat dissipation structures are provided, as are methods for the fabrication thereof. In various embodiments, the method includes the steps or processes of providing a module substrate, such as a circuit board, including a cavity having metallized sidewalls. A sinter-bonded heat dissipation structure is formed within the cavity. The sintered-bonded heat dissipation structure is formed, at least in part, by inserting a prefabricated thermally-conductive body, such as a metallic (e.g., copper) coin into the cavity. A sinter precursor material (e.g., a metal particle-containing paste) is dispensed or otherwise applied into the cavity and onto surfaces of the prefabricated thermally-conductive body before, after, or concurrent with insertion of the prefabricated thermally-conductive body. The sinter precursor material is then sintered at a maximum processing temperature to produce a sinter bond layer bonding the prefabricated thermally-conductive body to the metallized sidewalls of the module substrate.

The method for manufacturing a printed circuit board element (10) having an inlay (16) and a current sensor (30) for determining a current flowing in the inlay (16), wherein, for the improvement of the positional accuracy of the inlay (16) relative to the current sensor (30), the method comprises the following steps: providing a layer (12) of printed circuit board material having a recess (14), providing an inlay (16) having an inlay outline, inserting the inlay (16) in the recess (14); embedding the inlay (16) in the recess (14); completing and laminating the layered printed circuit board structure; applying at least two alignment markings (M1, M2) on an uppermost printed circuit board layer (AL); forming a defined cross-section tapering (S) on the inlay outline, the tapering being aligned with the at least two alignment markings (M1, M2); applying an assembly marking for a current sensor (30) on an uppermost printed circuit board layer (AL), the assembly marking being aligned with the at least two alignment markings (M1, M2).

A device embedded substrate provided with first and second connecting terminals on different surfaces, the substrate including: an electrically conductive metal block having one surface connected to the first connecting terminal, and having a dimension in a lateral direction larger than that of the electronic device; an intermediate connecting portion juxtaposed to the electronic device, including first insulation layer and wiring layers, whereby the first wiring layer is connected to the one surface of the metal block via a first conductive via; a second insulation layer which accommodates the metal block; and a third insulation layer stacked on the second insulation layer to embed the electronic device and whereon a second wiring layer is stacked, wherein the second wiring layer is connected to the first wiring layer via a second conductive via and connected to the second connecting terminal of the electronic device via a third conductive via.

An apparatus includes a main substrate, a device, and a heat spreader. The main substrate is configured for mounting the device in a mounting location thereon and having a cavity located below the mounting location. The device is mounted in the mounting location, and the heat spreader is fitted into the cavity and coupled to the device and to a heat sink. The heat spreader is configured to conduct heat from the device to the heat sink and to provide electrical insulation between the device and the heat sink.

High thermal performance microelectronic modules containing thermal extension levels are provided, as are methods for fabricating such microelectronic modules. In various embodiments, the microelectronic module includes a module substrate having a substrate frontside and a substrate backside. At least one a microelectronic device, such as a semiconductor die bearing radio frequency circuitry, is mounted to the substrate frontside. A substrate-embedded heat spreader, which is thermally coupled to the microelectronic device, is at least partially contained within the module substrate, and extends to the substrate backside. A thermal extension level is located adjacent the substrate backside and extends away from the substrate backside to terminate at a module mount plane. The thermal extension level contains a heat spreader extension, which is bonded to and in thermal communication with the substrate-embedded heat spreader.

A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided.

An electrical power supply device for at least one light source of the light emitting diode type and at least one electronic component, including a circuit for driving the electrical power supply of the light source or each light source, the drive circuit including at least one electrical conductor track and a housing for accommodating an insert, and an insert in an electrically conducting material, the insert being inserted in the accommodation housing and including a first end portion electrically connected to the conductor track, and a second end portion suited to being electrically connected to at least one electronic component so as to supply electrical power to the electronic component.

The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member.