A component carrier for carrying and cooling at least one heat generating electronic component is presented. The component carrier comprising includes an outer layer structure, an electrically insulating layer arranged adjacent to the outer layer structure, and a heat conducting structure arranged adjacent to the electrically insulating layer on a side opposite to the outer layer structure. The heat conducting structure is thermally coupled to the at least one heat generating electronic component such that the outer layer structure receives thermal radiation irradiated by the heat conducting structure and transports corresponding heat away from the component carrier via convection by a heat transfer medium surrounding the component carrier.

The present disclosure relates to a microelectronic package, which includes a base substrate, a perimeter wall, an electronic component, and a mold compound. The perimeter wall extends from a periphery of the base substrate to form a cavity that is over the base substrate and within the perimeter wall. The electronic component is mounted on the base substrate and exposed to the cavity. The electronic component is thermally coupled to a thermal management component, which extends through the base substrate and conducts heat generated from the electronic component. The electronic component is also electrically coupled to a wall signal via, which extends through the perimeter wall and transmits signals. The mold compound resides over the base substrate and within the cavity, so as to encapsulate the electronic component.

A high-density memory system includes at least one memory-dense compute unit with a printed circuit board (PCB) having a half-width one rack unit (1U) form factor, more than 20 memory module slots arranged depth-wise from a front to a rear of the PCB with a horizontal orientation that is parallel to the half-width 1U form factor, at least one processor positioned in between the memory module slots, a dripless connector with a first port that receives a cooling solution from a manifold of a cooling unit and a second port that returns the cooling solution into the manifold, tubing that extends the full length of the PCB from the first port past the memory module slots and the at least one processor and back to the second port, and cooling blocks that are located in between the memory module slots and that are connected to the tubing.

A method is provided for producing circuit boards with perforated shaped parts. The perforated shaped parts are arranged and fixed relative to one another in a specified configuration in order to form a semi-finished product with a perforated mask, wherein the semi-finished product is then positioned in a press using the perforated mask and is pressed together with at least one other element in order to form a circuit board substrate for producing a circuit board. A system is also provided for producing circuit boards in order to prepare corresponding semi-finished products and processing same in order to form a circuit board substrate for producing a circuit board.

A solid state power switch assembly of an aircraft solid state power controller includes a circuit board, at least one solid state power switch, and a busbar. The at least one solid state power switch has a first side and an opposing second side. A power switch electric contact surface is formed on the first side and the at least one solid state power switch is arranged on the circuit board with the second side facing the circuit board and the first side facing away from the circuit board. The busbar comprises at least one busbar contact portion configured for electrically contacting the power switch electric contact surface and at least one busbar mounting portion, which is configured for be mounted to the circuit board, so that the at least one solid state power switch is sandwiched between the at least one busbar contact portion and the circuit board.

The present disclosure discloses a printed circuit board, a method for manufacturing the same and an electronic device. The PCB includes: a core board assembly including a first core board and a second core board which are stacked together, wherein the second core board includes a metal layer formed on a side of the second core board oriented towards the first core board, and the first core board defines a through slot extending through the first core board; a radiator, disposed in the through slot; and a conductive adhering layer, disposed between the metal layer of the second core board and the radiator, wherein the conductive adhering layer is configured to electrically connect the radiator and the metal layer. The present disclosure connects the radiator directly with the metal layer. The implementation of the present disclosure may help cooling the metal layer to improve the cooling performance of the PCB.

A drive unit for a motor includes a printed circuit board (PCB); a first gallium nitride switch having a gate, the first gallium nitride switch mounted to the PCB; a second gallium nitride switch having a gate, the second gallium nitride switch mounted to the PCB; a gate driver generating a turn-off drive signal to turn off the first gallium nitride switch and turn off the second gallium nitride switch; a first turn-off trace on the PCB, the first turn-off trace directing the turn-off drive signal to the gate of the first gallium nitride switch; and a second turn-off trace on the PCB, the second turn-off trace directing the turn-off drive signal to the gate of the second gallium nitride switch; wherein an impedance of the first turn-off trace is substantially equal to an impedance of the second turn-off trace.

An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.

A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.