An electric motor includes an assembly for connection to a printed circuit having a conductive insert through which connection holes pass, and a coil assembly having electrical connections terminated by connection plugs. The motor further includes connection pieces comprising a rod, the outer cross-section of which matches the cross-section of the connection holes, the connection piece having, at the proximal end thereof, a shoulder with a cross-section greater than the cross-section of the connection holes, the opposite end having a slot extending up to the shoulder, and including an opening on the distal end with a width greater than or equal to the cross-section of the connection plugs and at least one narrowing with a width less than the cross-section of the connection plugs, in order to ensure the expansion of the collar of the connection piece engaged in the hole of the printed circuit insert.

A printed circuit board (PCB) is disclosed. The PCB includes a substrate having a plurality of through holes, a plurality of thermally-conductive blocks disposed in the through holes respectively, bonding structures respectively disposed in each through holes, and a metal circuit formed on the substrate. Particularly, the thermally-conductive block is tightly attached to the inner wall of the through hole through the bonding structure. In brief, the bonding structure includes a metal block and metal layers coated on both surfaces of the metal block to replace the conventional adhesive layer made of epoxy resin to tightly fix the thermally-conductive block in the through hole.

A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.

Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.

Provided is a circuit assembly that can suppress deterioration of its heat releasing capability caused by a pit formed by the formation of a protruding portion that enters an opening formed in a substrate. Provided is a manufacturing method with which such a circuit assembly can be produced easily. A conductive member is provided with a protruding portion that enters an opening formed in a substrate and to which a terminal of an electronic component is connected, a pit formed by formation of the protruding portion is covered by a base member for supporting the conductive member, and an embedding member having a heat conductivity higher than that of air is provided inside the pit.

A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity of the substrate, a first build-up layer laminated on first side of the substrate and including insulating resin layers such that the first build-up layer is covering first surface of the block from the first side, and a second build-up layer laminated on second side of the substrate and including insulating resin layers such that the second build-up layer is covering second surface of the block from the second side. The first build-up layer includes an electronic component mounting structure formed on outermost portion of the first build-up layer, and the block is formed such that the first and second surfaces have roughened surfaces, respectively, and that the roughened surface of the first surface has surface roughness different from surface roughness of the roughened surface of the second surface.

The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the microelectronic substrate, wherein the microelectronic package may include an interposer having a first surface and an opposing second surface. A microelectronic device may be attached to the interposer first surface and the interposer may be attached to the microelectronic substrate by the interposer first surface such that the microelectronic device extends into the opening. At least one secondary microelectronic device may be attached to the interposer second surface.

The invention relates to a circuit carrier (1) comprising a plurality of inorganic substrate layers (1.1) that have partial metallizations (1.2, 1.3, 1.4, 1.5, 1.6) for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (1). According to the invention, at least one partial metallization is made in the form of an insert (1.2) that fills a corresponding shaped hole (1.7) introduced into one of said inorganic substrate layers (1.1).

A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.