The embodiments of the present disclosure provide a flexible filament splicing structure, comprising a plurality of flexible filaments. Each of the plurality of flexible filaments includes a flexible substrate and at least one LED chip. The flexible substrate is provided with a conductive circuit layer. The at least one LED chip is disposed on the flexible substrate. The at least one LED chip is electrically connected with the conductive circuit layer. Two adjacent flexible filaments are electrically spliced with each other to enable the plurality of flexible filaments to form an integrated spliced structure.

A power electronics assembly includes a circuit board assembly including a first electrically insulating layer, an electrically insulating substrate, a laminate panel provided between the first electrically insulating layer and the electrically insulating substrate, and one or more electrically conductive layers provided within the electrically insulating substrate. The laminate panel includes a power electronics device assembly including an S-cell and a power electronics device. The S-cell includes a graphite layer and a metal layer encasing the graphite layer. A recess is formed in an outer surface of the metal layer and the power electronics device is disposed within the recess of the outer surface of the S-cell.

An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof.

A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.

A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

A light-emitting module is provided. The light-emitting module includes an insulating substrate. The insulating substrate includes a mounting surface, a rear surface, and a through hole that passes from the mounting surface to the rear surface. A light-emitting element is on the mounting surface. A thermal conductor is disposed in the through hole in contact with an inner wall of the insulating substrate defined by the through hole. The thermal conductor includes a mounting-side end face thermally connected to the light-emitting element, a rear-side end face, and a displacement suppressing portion that suppresses displacement of the thermal conductor in a direction from the rear surface to the mounting surface. thermal conductor. The rear-side end, in a cross-section parallel to the rear surface of the insulating surface, is larger in surface area than the mounting-side end, in a cross-section parallel to the mounting surface of the insulating substrate.

The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

A circuit structure that has a high rigidity, has high cooling performance for an electronic component, and can reduce electrical resistance between the electronic component and a bus bar. The circuit structure has a circuit board, bus bars, a binding material, metal chips, and electronic components. The circuit board has opening portions that penetrate in the thickness direction. The bus bars are overlaid on the circuit board. The binding material is interposed between the circuit board and the bus bars and binds them. The metal chips are arranged inside the opening portions and also placed on the bus bars. The metal chips each have a top face, which is located in approximately the same plane as an opening end face of an opening portion, and a bottom face, approximately the entire surface of which is joined to a bus bar. The electronic components are soldered to the circuit board and the top faces of the metal chips.