A device used for attaching a semiconductor device to a circuit board over a first temperature. The device includes a hook member that includes a first hook, a second hook, and a body between the first hook and the second hook. The body has a first surface, a second surface opposite the first surface, and a first hole extended from the first surface to the second surface. The device further includes a fixing member and a holder. The fixing member has a second hole, and the holder passes through the first hole and the second hole, and is engaged with the fixing member.

A near-field communication data carrier is adapted to be mounted in a metal object including a housing, an electronic assembly. The electronic assembly is disposed in the housing and includes a circuit board, a near-field communication chip, and a coil set. The circuit board has a first side and a second side, which are back to each other. The near-field communication chip is disposed on the first side. The coil set is disposed on the second side. The coil set includes a magnetic core and a coil. The coil is wound around the magnetic core and is electrically connected to the near-field communication chip.

A lighting system includes an optical unit. The optical unit includes at least one light guide, which is provided for at least one light source. The lighting system further includes a retaining frame for the optical unit, via which frame the optical unit is fastened to a printed circuit board including the at least one light source, and a spacer for positioning the optical unit, which spacer is arranged between the retaining frame and the printed circuit board, the spacer having at least one continuous bearing opening in order to receive the at least one light guide. At least one guide recess is formed on the edge of the at least one bearing opening and at least one support face is provided on the edge, on which support face the light guide introduced into the bearing opening can be supported.

A near-field communication data carrier is adapted to be mounted in a metal object including a housing, an electronic assembly. The electronic assembly is disposed in the housing and includes a circuit board, a near-field communication chip, and a coil set. The circuit board has a first side and a second side, which are back to each other. The near-field communication chip is disposed on the first side. The coil set is disposed on the second side. The coil set includes a magnetic core and a coil. The coil is wound around the magnetic core and is electrically connected to the near-field communication chip.

A bridge array for connecting electronic components within a housing includes an array bracket and a plurality of connection modules coupled to the array bracket. Each connection module includes a first electrical connector configured to receive a first electronic component, and a second electrical connector configured to receive a second electronic component; thereby physically and electrically connecting the first electronic component and the second electronic component of each connection module. The array bracket includes a first electrical port electrically connected to the first electrical connector of each connection module. The first electrical port provides a common connection to the first electronic component of each connection module. The array bracket includes a second electrical port electrically connected to the second electrical connector of each connection module. The second electrical port provides a common connection to the second electronic component of each connection module.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

A display apparatus includes a display panel and a backlight unit. The backlight unit includes a light source, a first substrate on which the light source is mounted, a driving substrate which supplies driving power to the light source, a second substrate connecting the first substrate to the driving substrate, a connector mounted on the driving substrate and coupled to the second substrate, and a dam mounted on the driving substrate and facing the connector with the second substrate interposed therebetween. The dam restricts movement of the second substrate in a direction away from the connector.

A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

Provided is a frame assembly for fixing a plurality of stacked battery cells. The frame assembly may include: a frame including an upper surface, a first side surface connected to a first end of the upper surface and a second side surface connected to a second end of the upper surface, the frame being configured to enclose the plurality of battery cells; a plurality of first bus bars disposed on the first side surface; a plurality of second bus bars disposed on the second side surface; and a flexible printed circuit board disposed along the upper surface, the first side surface, and the second side surface of the frame, the flexible printed circuit board being configured to sense the plurality of battery cells.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.