A printed circuit board enclosure employs a box having an open base and opposing side plates. Securing tabs extend laterally from the side plates. The securing tabs have bottom surfaces that are coplanar extensions of a bottom surface of the box and are configured to be attached to the main circuit board. A cover is received on the box. The cover is configured to close the open top of the box. The cover has side flanges extending downwardly from a top plate with mating tabs extending laterally from the side flanges aligned with the securing tabs.

Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

An electronic assembly includes a printed wiring board (PWB), and a stiffener secured to the PWB. The stiffener includes one or more tray sections. One or more electronic modules is secured respectively to the one or more tray sections of the stiffener.

The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

An electrical connector assembly includes an insulative housing, a plurality of contacts retained to the housing, a metallic frame/fastener surrounding the housing, a retainer/clip positioned upon the housing and retaining a CPU thereon. The metallic frame includes four positioning posts at four corners, and the retainer includes a frame part to form a receiving space for receiving the CPU therein, and further includes four metallic retaining supports embedded within four corners of the retainer corresponding to the four positioning posts so as to allow the four positioning posts to extending therethrough in the vertical direction.

A support structure supports a component mounted on a mounting surface of a structure by pressing the component to the mounting surface side and includes a first support tool and a second support tool used so that the component is pressed to the mounting surface side and supported and a fixing portion provided on the structure and fixing the first support tool and the second support tool. The first support tool and the second support tool are fixed to the same fixing portion.

A microchip includes a PCB, a first contact feature positioned along a first area of the PCB, a second contact feature positioned along a second area of the PCB that is disposed opposite the first area, a contact frame including first and second contact members respectively coupled to the first and second contact features for signal communication between the first and second contact features and an external electronic device, and a housing enclosing an interior region of the microchip and carrying the first and second contact members of the contact frame.

Embodiments describe an electronic device fastener including a base link bar, and a pair of corner retaining features coupled to the base link bar. Each corner retaining feature includes a base being formed of a planar structure and having a base top surface, a support rail extending from a portion of the base top surface and having a support rail top surface, a fastening feature defined by surfaces of the base and support rail and comprising vacant space extending through the base and at least a portion of the support rail, a guide wall extending from a portion of the support rail top surface, a retaining protrusion extending from the guide wall toward a center line of the electronic device fastener, and a stopper positioned beside the base link bar and at back ends of the base, the support rail, the guide wall, and the base link bar.

A circuit board assembly includes a circuit board having a pair of slots spaced apart from each other and a terminal opening disposed between the pair of slots; and a tuning fork. The tuning fork includes a pair of terminals; a pair of shoulders, the pair of terminals attached to the pair of shoulders, each of the pair of shoulders extending orthogonal from a bottom of the pair of terminals; and a pair of supports extending upwardly from a corresponding one of the pair of shoulders, the pair of terminals disposed between the pair of support portions, the pair of support portions configured to engage a corresponding one of the pair of slots so as to place the pair of terminals within the terminal opening of the circuit board.

Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.