An electronic circuit card comprises a printed circuit board with electronic components. The electronic components comprise drivers for transmitting transmit (TX) signals and receivers for receiving receive (RX) signals, according to several groups of interface signals. There is further provided a connector edge, arranged at an edge of the card, and configured to allow the card to be connected to an external connector. This connector edge comprises two subsets of symmetric pins on respective (opposite) sides thereof. The drivers and the receivers are connected to the pins, for respectively conveying the TX signals and the RX signals. Pins are assigned such that, for each of the several groups of supported interface signals, any pin (of any of the subsets) connected to transmit TX signals is located opposite a pin (of the other subset) connected to receive RX signals. Pairs of consecutive pins (on each side) typically come in differential pairs.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

A keyboard includes a base plate, a pressure sensing layer, plural key structures, a circuit board, a flexible layer and a controlling unit. The pressure sensing layer is disposed on the base plate and located under the circuit board. The flexible layer is disposed on the pressure sensing layer and located under the circuit board. While a key structure is depressed, a part of the key structure is penetrated through the circuit board to press the flexible layer, and a force is transmitted from the flexible layer to the pressure sensing layer. The controlling unit compares the force with a predetermined force value. According to the comparing result, the controlling unit generates a corresponding pressure sensing signal. Consequently, the use of a single key structure can achieve the functions of multiple keys.

A keyboard includes a base plate, a pressure sensing layer, plural key structures, a circuit board, a flexible layer and a controlling unit. The pressure sensing layer is disposed on the base plate and located under the circuit board. The flexible layer is disposed on the pressure sensing layer and located under the circuit board. While a key structure is depressed, a part of the key structure is penetrated through the circuit board to press the flexible layer, and a force is transmitted from the flexible layer to the pressure sensing layer. The controlling unit compares the force with a predetermined force value. According to the comparing result, the controlling unit generates a corresponding pressure sensing signal. Consequently, the use of a single key structure can achieve the functions of multiple keys.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin disposed to cover the first surface and the first component; a shield film covering at least a side surface of the first sealing resin; a first ground terminal mounted on the first surface; and a protruding portion formed to extend laterally at any position of the first ground terminal in a direction parallel to the first surface. The protruding portion is electrically connected to a portion of the shield film that covers the side surface of the first sealing resin.

A wiring board with a built-in electronic component includes a core substrate, an electronic component in the substrate, a first upper-layer structure on first surface of the substrate, a second upper-layer structure on second surface of the substrate, and via conductors in the substrate and first upper-layer structure such that the via conductors are connected to an electrode of the component. The substrate has an accommodating layer, a first connection layer on first surface of the accommodating layer, and a second connection layer on second surface of the accommodating layer, the accommodating layer includes inner wiring and insulation layers and has cavity accommodating the component, the first connection layer includes inner wiring and insulation layers, and the second connection layer includes inner wiring and insulation layers such that the second connection layer includes greater number of inner wiring and insulation layers than the first connection layer.

Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.

In an electro-optical device, a first substrate is provided with a temperature detection element and an electro-static protection circuit that protects the temperature detection element from a surge current. A first resistor element is electrically coupled to the temperature detection element in series. The electro-static protection circuit includes a transistor electrically coupled to the first resistor element and the temperature detection element in parallel. A first capacitance element is provided on a wiring substrate electrically coupled to the first substrate, and is provided between a first coupling wiring line electrically coupled to one side of the temperature detection element and a second coupling wiring line electrically coupled to the other side thereof.