An electronic device module includes a first substrate having at least one or more electronic devices mounted on one surface thereof, a second substrate bonded to one surface of the first substrate and including at least one device accommodating part having a space in which the electronic device is accommodated, and a shielding member disposed in the device accommodating part and accommodating at least one or more electronic devices therein.

A printed circuit board includes: a printed wiring board including an insulating layer wherein a recessed part is provided on a top surface of the insulating layer, and a printed conductor provided inside the recessed part; a bare chip part mounted in the recessed part and electrically connected to the printed conductor; an electronic part mounted on the top surface of the printed wiring board other than the recessed part; and a cap fixed to the top surface of the printed wiring board and hollow-sealing the bare chip part mounted in the recessed part, wherein using a height of the top surface of the printed wiring board as a reference, a height of a top surface of the cap is equal to or below a maximum height of a top surface of the electronic part.

An integrated coil module includes: a substrate; a plurality of inductor elements arranged on the substrate with a spacing distance between adjacent inductor elements, the inductor elements each including an iron core, first and second coils wound on the iron core, first and second flanges at two sides of the iron core, and a third flange arranged on the iron core and between the first and second flanges, the first flange including first and second electrodes, the second flange including third and fourth electrodes, the third flange including fifth and sixth electrodes; and a plate arranged atop the plurality of inductor elements to cover the inductor elements. As such, the plurality of inductor elements are integrated together as a one-piece structure to thereby simplify the SMT manufacturing process and shorten the spacing distance between the inductor elements so as to reduce the area of the substrate occupied thereby.

Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

The printed circuit with a multi-layer structure comprises: a first layer machined to form a spotface passing through the layer, a second layer comprising a first cavity passing through the layer, a third layer comprising, on one face, an electronic component that is in the first cavity, a fourth layer comprising a second cavity, a heat-conducting element with two parts: one made of metal, called a thermal cover, inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, the other made of a dielectric material with heat conduction >30 W/(m.Math.K), placed in the first cavity so as to be in contact with the electronic component.

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Compact designs for a printed circuit board (PCB) device of a smartcell battery system are provided. The design includes a number of features, including a direct current to direct current (DCDC) converter having a compact, low-cost design that can provide significant power output despite operating at low voltages. In an example, the DCDC converter includes a number of features, including but not limited to, a closed loop for the primary side winding, integrated leakage inductance, a planar integrated transformer, a modular exchangeable secondary side winding, and two variants of secondary side rectification depending on the desired output voltage. The components of the DCDC converter respectively have planar or substantially planar geometries that enable the DCDC converter to have a compact, planar geometry with an overall thickness of about 1.0 millimeter.

Compact designs for a printed circuit board (PCB) device of a smartcell battery system are provided. The design includes a number of features, including a scalable, high performance power module. The power module includes a number of power switches (e.g., metal oxide semiconductor field effect transistors (MOSFETs)), that have low resistance which can control very high currents of a direct to direct (DCDC) converter and an H-bridge of the PCB. The power module is sandwiched between the input and output busbars positioned on opposite surfaces of the primary, planar substrate of the PCB in order to create the shortest possible current transfer distance.

Apparatus and methods related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mound device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.