Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

A lighting fixture, including a bus printed circuit board that receives power from an external source, may be configured with programmable drivers. The bus printed circuit board has mechanical features for receiving the programmable drivers to mechanically mount the programmable driver to the bus printed circuit board. Each programmable driver may have a set of spring contacts positioned to engage exposed pads of the bus printed circuit board when the programmable driver is mounted to the bus printed circuit board, to supply power to the programmable driver. The lighting fixture further includes one or more light sources driven by the programmable drivers.

A flexible electronic foil (1,1′,1″) comprising a flexible substrate (2) and at least one electrically conducive portion (3) arranged to the substrate (2). The foil (1,1′,1″) comprises mechanical fastening means (6,6′,7) for mechanical fastening of the electronic foil (1,1′,1″), the mechanical fastening means being part of the substrate (2) of the electronic foil (1,1′,1″).

A lighting fixture includes a bus printed circuit board that receives power from an external source. The bus printed circuit board has traces that route the power to a set of exposed pads, and also has mechanical features for receiving an electronic device. The lighting fixture further includes a set of one or more drivers, having mechanical features for engaging the mechanical features of the bus printed circuit board to mechanically mount the driver to the bus printed circuit board. Each of the set of one or more drivers further includes a set of spring contacts positioned to engage at least some of the exposed pads of the bus printed circuit board when the driver is mounted to the bus printed circuit board, to supply power to the driver. The lighting fixture further includes one or more light sources driven by the one or more drivers.

An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.

The application discloses a dual-layer display assembly and a display device. The dual-layer display assembly includes a first display screen, a second display screen, a first print circuit board, a second print circuit hoard and a fixing structure, where the second display screen is arranged in layers with the first display screen; the first print circuit board drives the first display screen; the second print circuit board drives the second display screen; and the fixing structure connects and fixes the first print circuit board and the second print circuit board.

The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular. The third and fourth connection terminals include a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular.

A system includes a top printed circuit (PCB) including an array of contact pads, a bottom PCB including an array of contact pads, at least one interposer positioned between the top and bottom PCBs, including: an array of top connectors configured to contact the array of contact pads of the top PCB; an array of bottom connectors configured to contact the array of contact pads of the bottom PCB; and interconnections configured to electrically connect the top connectors and the bottom connectors, at least one spacer element positioned between the top PCB and the bottom PCB and configured to contribute to maintaining a specified distance between the top PCB and the bottom PCB; and at least one fastener of the top PCB and the bottom PCB. The system further includes fasteners configured to press the top PCB, the interposer, the bottom PCB, and the spacer layer together.