The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

Assembly workability of an electric compressor to which an inverter circuit section and a filter circuit section are attached is improved. The inverter circuit section (3) includes an inverter control board (17), a sleeve assembly (18), and a power module (14). The inverter control board, the sleeve assembly, and the power module are integrated. The filter circuit section (4) includes a filter circuit board (66) and a support member (67). The filter circuit board (66) and the support member (67) are integrated. The inverter circuit section and the filter circuit section are structured to be capable of being stored each individually within an inverter storing section (8) from the same direction and detachably attached to the housing (2).

A lighting fixture includes a bus printed circuit board that receives power from an external source. The bus printed circuit board has traces that route the power to a set of exposed pads, and also has mechanical features for receiving an electronic device. The lighting fixture further includes a set of one or more drivers, having mechanical features for engaging the mechanical features of the bus printed circuit board to mechanically mount the driver to the bus printed circuit board. Each of the set of one or more drivers further includes a set of spring contacts positioned to engage at least some of the exposed pads of the bus printed circuit board when the driver is mounted to the bus printed circuit board, to supply power to the driver. The lighting fixture further includes one or more light sources driven by the one or more drivers.

A press-fit mounting peg (2) for retaining a component such as a stepped-motor on a circuit board (21). The mounting peg (2) is securable in a mounted position by a first axial displacement of a locking pin (17) along a pin channel (16) of the press-fit mounting peg (2) in a first axial direction along a longitudinal axis of the press-fit mounting peg (2) from a first axial position to a second axial position. The pin channel (16) comprises at least one pin displacement stop (13, 20) for stopping a second axial displacement of the locking pin (17) out of the second axial position.

A mounting structure of the present disclosure includes a package on whose upper surface an electronic component is mounted, a voltage regulator module, a mother board for mounting the package on an upper surface of the mother board, a driver, a plurality of connectors for electrically connecting a conductor layer of the mother board and a conductor layer of the package to each other, and a heat sink.

The present disclosure relates to a substrate apparatus and a method of manufacturing a substrate apparatus capable of improving a manufacturing quality and reliability of the substrate apparatus as an electronic device. By laminating a plurality of sheet-like substrates on which a wiring pattern is formed, an individual substrate in which internal wiring is formed is formed, and the individual substrate physically and electrically connects two substrates. The present disclosure is capable of being applied to the substrate apparatus.

A manufacturing method of a component embedded package carrier includes the following steps: providing the dielectric layer; a first copper foil layer and a second copper foil layer; forming a plurality of through holes; forming a conductive material layer on the first copper foil layer and the second copper foil layer; patterning the conductive material layer, the first copper foil layer and the second copper foil layer, thereby defining the conductive through hole structures, the first patterned conductive layer and the second patterned conductive layer and forming the core layer comprises; disposing at least one electronic component inside the opening of the core layer; laminating a first insulating layer and a first circuit layer located on the first insulating layer onto the first patterned conductive layer; laminating a second insulating layer and a second circuit layer located on the second insulating layer onto the second patterned conductive layer.

A method for modifying a low-cost small form factor pluggable optical-electrical bidirectional transceiver (hereinafter SFP transceiver) by converting the SFP transceiver into a dual-in-line package. Such conversion enables the SFP transceiver to be soldered directly on a printed circuit board of a line replaceable unit of an avionics system, thereby eliminating the concern that the SFP transceiver may become detached due to vibration during aircraft operation. The method also includes a sealing process to protect the contact pads on the SFP transceiver, thereby eliminating any concern that the contact pads could corrode due to long-term moisture and humidity exposure. The product of the method is a ruggedized SFP transceiver capable of withstanding the rigors of operating in a harsh avionics environment onboard an aircraft.

Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.