Methods to form a device whereon flexible component elements are attached upon three-dimensional surfaces are described. In some aspects, the present invention includes incorporating flexible semiconductor devices onto three-dimensional surfaces with electrical contacts. In some aspects, the formed device may be incorporated in an ophthalmic device.

A power supply device that includes a plurality of electricity storage elements each including lead terminals; a conductive connector connected to the lead terminals; a circuit board including a conductive path; a conductive relay terminal electrically connected to the conductive path, the connector being disposed so as to be in contact with the relay terminal; and a resin holder configured to hold the plurality of electricity storage elements, wherein the holder includes an electricity storage element holder configured to hold the electricity storage elements, a connecting member holder configured to hold the connector, and a fitting groove into which the lead terminals can be fitted, and the connecting member holder is formed so as to traverse the fitting groove.

The present invention provides a device with rear-mounted vacuum tubes, comprising a protective cover with a plurality of heat dissipating holes, a rear panel with a panel opening, and at least one vacuum tube, wherein the vacuum tubes are arranged in a containing space of the protective cover through the panel opening and inserted to a connection circuit board for coupling to a printed circuit board. In addition, the protective cover, the rear panel, and the vacuum tubes are placed in parallel with the printed circuit board, so that heat dissipation for the device is improved and replacement and maintenance of the vacuum tubes are easier. In particular, a vacuum tube audio amplifier apparatus having the device with rear-mounted vacuum tubes as disclosed herein can be stacked.

An apparatus for containing battery cells includes a containment structure disposed on a printed circuit board for encasing a first battery cell, the first battery cell being electrically coupled to the printed circuit board, the containment structure being a first blast plate structure coupled a first blast tube structure. The apparatus further includes the first blast tube structure partially surrounding the first battery cell, where a bottom surface of a first end of the first blast tube structure is coupled to a top portion of the printed circuit board. The apparatus further includes the first blast plate structure coupled to a top surface of a second end of the first blast tube structure. The apparatus further includes a first thermal interface material at least partially surrounding the first battery cell, where the first thermal interface material is located between the first battery cell and the first blast tube structure.

An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.

Methods to form a device whereon flexible component elements are attached upon three-dimensional surfaces are described. In some aspects, the present invention includes incorporating flexible semiconductor devices onto three-dimensional surfaces with electrical contacts. In some aspects, the formed device may be incorporated in an ophthalmic device.

A semiconductor storage device including a board, an electronic component, and a holder. The board has a region with an opening. The electronic component includes a component body disposed in the opening and a lead protruding from the component body and connected to the board. The holder is disposed in the opening and supports the component body. The region includes first and second edges on either side of the opening, the first and second edges extending along a first direction and separated from each other in a second direction crossing the first direction. The holder includes a holder body at least partially formed in an annular shape and into which the component body is inserted, a first groove extending along the first direction and engaged with the first edge, and a second groove extending along the first direction and engaged with the second edge.

The present disclosure provides a printed circuit board with a plated through hole. The through hole covered by a solder pad at both ends of the through hole. At least two pins are plugged into the through hole, one of which with its head end being thermal contacted with one of the solder pads. Another pin's head end being thermal contacted with the other solder pad. The at least two pins are thermal contacted with one another. Thermal dissipation rate is increased with the structure of the through hole.

Disclosed herein are devices, methods, and methods of making devices for facilitating condition monitoring of machinery allowing improve efficiencies and increased lifetime of the machinery while also reducing maintenance. In one embodiment, a device includes an enclosure assembly and a printed circuit board (PCB) assembly. The enclosure assembly includes a cap, a base mechanically coupled with the cap, and a support bracket mechanically coupled with the base. The PCB assembly includes a processor, a memory coupled with the processor, a first sensor electrically coupled with the processor, a second sensor electrically coupled with the processor, and a communication interface electrically coupled with the processor. The device, when installed, may generally form a shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

A resin molded substrate has at least a pair of terminal through holes for allowing lead terminals of a cylindrical capacitor to be inserted through, and at least one protrusion for supporting a side of a bottom portion of the capacitor so as to space from a front surface of the substrate the side of the bottom portion of the capacitor having the lead terminals inserted through the terminal through holes. The pair of lead terminals at the bottom portion are inserted through the terminal through holes of the resin molded substrate, whereby the capacitor is mounted in an upright state with a solder, so that the protrusion spaces the side of the bottom portion from the front surface of the resin molded substrate.