H05K2201/1059

Connection assembly for connecting a thin conductor piece to a thick conductor piece
10892568 · 2021-01-12 · ·

A connection assembly generally comprising a thick conductor piece including a receptacle with an inner wall and a thin conductor piece. The thin conductor piece has a protrusion for insertion into the receptacle. A press-fit element can be inserted into the receptacle with the protrusion arranged in the receptacle between the press-fit element and the thick conductor piece.

Method for contacting a contact surface on a flexible circuit with a metal contact, crimping part, connection of flexible circuit and metal contact and control device

The disclosure relates to a method for contacting a contact surface on a flexible circuit board with a metal contact outside the flexible circuit board, with the aid of a press-fit pin. An attachment piece having a sleeve for receiving the press-fit pin is a mechanically and electrically coupled to the flexible circuit board.

Preformed solder-in-pin system
10886685 · 2021-01-05 · ·

A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

METHOD OF INTERCONNECTING PRINTED CIRCUIT BOARDS
20200412034 · 2020-12-31 ·

A method of interconnecting first and second printed circuit boards using a float connector with a contact assembly that includes installing a first guide member onto the first printed circuit board with the float connector in an open non-compressed position, after installing the first guide member onto the first printed circuit board, installing a second guide member onto the second printed circuit board with the float connector in the open non-compressed position, and compressing the first and second printed circuit boards toward one another to move the float connector from the open non-compressed position to a compressed position until contact ends of the contact assembly of the float connector are exposed outside of the first and second guide members, respectively, thereby electrically connecting the contact ends to the first and second printed circuit boards, respectively, for electrical connection between the first and second printed circuit boards through the float connector.

PRESS-FIT CONNECTION
20200403332 · 2020-12-24 · ·

An apparatus may include a press-fit connection for a printed circuit board and a connecting element, where the connecting element is pressed into the printed circuit board in that the connecting element is tapered at the end facing the printed circuit board, and where an insertion depth to which the tapered section is inserted in the printed circuit board ensures a compensation for tolerances.

ELECTRONIC ASSEMBLY WITH THERMAL FUSE, AN ELECTRIC MOTOR AND A DRIVE OF A MOTOR VEHICLE
20200381205 · 2020-12-03 ·

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

Electromagnetic interference (EMI) shield for circuit card assembly (CCA)

Apparatus and method for providing an electromagnetic interference (EMI) shield for removable engagement with a printed circuit board (PCB). A shaped electrically conductive member has a substantially planar member portion with multiple lateral member edges. The sidewalls are disposed at respective lateral member edges and are substantially orthogonal to the substantially planar member portion. At least one of the sidewalls includes at least one first snap-fit latching feature to engage a respective complementary second snap-fit latching feature disposed at one or more of multiple peripheral portions of a PCB.

SEMICONDUCTOR MODULE
20200358211 · 2020-11-12 · ·

A semiconductor module, including a plurality of semiconductor elements, each of which has a main electrode and a control electrode, an enclosure that encloses the plurality of semiconductor elements, a plurality of first connection terminals, each of which is electrically connected to the control electrode of one of the semiconductor elements and extends from the enclosure, and a plurality of second connection terminals, each of which is electrically connected to the main electrode of one of the semiconductor elements and extends from the enclosure. Each of the second connection terminals includes a press-fit part formed in substantially a plate shape having two plate surfaces. For a portion of the press-fit part, the two plate surfaces thereof are separated from each other in a thickness direction of the press-fit part, at least one of the plate surfaces thereof having elasticity, to thereby form an elastic part of the press-fit part.

ULTRASONIC PROBE, AND ULTRASONIC TRANSMITTER-RECEIVER SYSTEM USING THE SAME

Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

Mounting peg

A press-fit mounting peg (2) for retaining a component such as a stepped-motor on a circuit board (21). The mounting peg (2) is securable in a mounted position by a first axial displacement of a locking pin (17) along a pin channel (16) of the press-fit mounting peg (2) in a first axial direction along a longitudinal axis of the press-fit mounting peg (2) from a first axial position to a second axial position. The pin channel (16) comprises at least one pin displacement stop (13, 20) for stopping a second axial displacement of the locking pin (17) out of the second axial position.