The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

A circuit arrangement (1), in particular for an electrically driven motor vehicle, has at least one bus bar (5) which is connected electrically to a supplier (2) and which is connected to a first consumer (3) at a first transfer point (6) and to a second consumer (4) at a second transfer point (7). Both the first and the second transfer point (6, 7) are formed as flexible contact points.

Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.

A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.

This application provides a board-level architecture and a communications device. The board-level architecture includes a support board, a switch board, and a press fit component. The press fit component includes a cable, a first connector component press-fitted on a side edge of the support board, and a second press fit cable connector press-fitted on a side edge of the switch board. The first connector component includes a first press fit cable connector and a pluggable connector that is electrically connected to the first press fit cable connector, and the pluggable connector is farther from the support board than the first press fit cable connector. The first press fit cable connector is connected to the second press fit cable connector through the cable.

A power converter, for a vehicle that is at least partially electrically powered, has a first printed circuit board with DC link capacitors, a circuit breaker group for each alternating current phase, and terminals for alternating current busbars and direct current busbars. A second printed circuit board has a control apparatus for actuating the circuit breaker groups. Also, it has a respective signal pin carrier for the respective circuit breaker group. The signal pin carrier connects the first and the second printed circuit board. Thus, signals between the first and the second printed circuit board can be transmitted via the respective signal pin carrier. The signal pin carrier has six signal pins that are arranged on a plastic carrier.

A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

An optical module (100) for reading a test region of an assay. The optical module comprises: a first light source (101) for illuminating the test region of the assay; an optical detector (103), comprising an optical input for receiving light emitted from the test region and an electrical output; a substrate (104) for mounting the first light source (101) and the optical detector (103); and a housing (105) comprising: a first opening (106) for providing a first optical path from the first light source (101) to the test region (103); wherein the housing (105) and the substrate (104) enclose and positionally align the first source (101) and the optical detector (103) relative to the first opening (106). The housing (105) may comprise one or more legs (108), such as a flexible hook portion which secures the housing (105) to the substrate (104) with a snap-fit engagement, extending from a first and/or second outer surface of the housing (105) in a vertical direction. Beneficially, the snap-fit engagement provided by the flexible hook portion allows the housing to be aligned and secured without the need to use glue or for example a screw and thread that can be difficult to control and/or risks misalignment of the housing.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.