An electrical connector includes: an insulating housing; and plural terminals held in the insulating housing and arranged in terminal pairs, each of the terminals including: a holding portion held in the insulating housing; a cantilever extending forward from the holding portion, a slot being provided on the cantilever; a contact portion at a front of the cantilever; and a mounting portion for mounting on a circuit board; wherein the slot extends to the contact portion; and in each terminal pair, a first distance from a center of the contact portion of one terminal thereof to a center of the contact portion of the other terminal thereof is less than a second distance from a center of the mounting portion of one terminal thereof to a center of the mounting portion of the other terminal thereof.

A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

An electrical circuit device comprises at least one first power electronics module, at least one second power electronics module, a circuit board and a supporting structure, wherein the power electronics modules each lie by a contact side against an associated contact surface of the supporting structure and have one or more terminal pins connected to the circuit board on and/or next to a connection side situated opposite the contact side, wherein the first power electronics module has a lesser thickness between the contact side and the connection side than the second power electronics module, wherein the contact surface against which the contact side of the first power electronics module bears has a lesser distance from the circuit board than the contact surface against which the contact side of the second power electronics module bears, and/or wherein the terminal pins of the first power electronics module are longer than the terminal pins of the second power electronics module.

A high-frequency circuit including a circuit board which bears at least one electronic component and a conductor structure, and including a waveguide structure manufactured separately from the circuit board. The waveguide structure is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure. The waveguide structure is held with the aid of press-fit pins on the circuit board.

A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.

A coupling device for coupling a plurality of cable units to a component carrier includes a base plate that is flat in at least one plane. A connecting device is disposed on a first side of the base plate and is configured to mechanically couple the base plate to the component carrier. An opening extends through the base plate for each cable end of a plurality of cable ends of the cable units. The opening in each case is disposed on the base plate at a position corresponding to the respective cable unit.

A circuit carrier arrangement includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.