A connection element for electrically connecting a circuit carrier to another circuit carrier includes at least one solder connection for soldering onto the surface of the circuit carrier and a connection pin, which is electrically connected to the solder connection, for inserting into the other circuit carrier. The connection element has a holding body and a contact element which is connected to the holding body and which is designed to be elastic. The contact element has an end section, the solder connection being formed on the end section. The connection element has a locking element which is connected to the connection element in a movable manner back and forth between a locking position and a release position. The locking element is designed to limit the displacement of the contact element in the locking position and release an elastic movement of the contact element in the release position.

An electrical connector includes an insulating body, a conductive terminal, an adapter circuit board and a cable. The insulating body includes a terminal receiving groove extending along a first direction. The conductive terminal includes a fixing portion, a mating portion and a mounting portion. The mating portion is located in the terminal receiving groove. The transfer circuit board includes a conductive hole. The mounting portion of the conductive terminal is inserted into the conductive hole. The cable is electrically connected to the adapter circuit board. The cable extends in a second direction perpendicular to the first direction. A method for making the electrical connector and a connector assembly having the electrical connector are disclosed.

An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.

An electric motor includes a printed circuit board, a rotor which is mounted rotatably about an axis of rotation, and a stator circumferentially surrounded by the rotor. The stator includes stator teeth and coils wound around the stator teeth, the coils being made from a winding wire with winding wire ends. The stator is overmolded by an injection molding, and a plug assembly is made on an upper side of the stator by the injection molding. The plug assembly includes contacts overmolded by the injection molding and defining a plug connection of an external power supply connection on one side and making direct electrical contact with the printed circuit board on another side.

An electric motor includes a rotor which is mounted rotatably about an axis of rotation and which surrounds a stator on a circumferential side, the stator including stator teeth and coils wound around the stator teeth, the coils being made of a winding wire with winding wire ends, and a printed circuit board. The stator is encapsulated by an injection molding. Receptacles are provided on an upper side of the stator. At least one winding wire end is inserted into the receptacles. An insulation displacement contact is inserted into the receptacles to make electrical contact with the at least one winding wire end. The insulation displacement contact includes a plug-in pin which makes direct electrical contact with the printed circuit board.

A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.

A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.