Patent classifications
H05K2201/1059
Semiconductor device and semiconductor device fabrication method
A semiconductor device includes a printed circuit board in a peripheral portion of a housing portion of a case in which a laminated substrate is housed. A terminal block holding control terminals from which control signals are outputted to the printed circuit board is disposed over the printed circuit board. A gate electrode of a semiconductor chip and the printed circuit board are electrically connected by a wire.
Connector for low loss interconnection system
A modular electrical connector facilitates low loss connections to components on a printed circuit board. A portion is of the connector is formed of one or more first type units with conductive elements designed to be attached to a printed circuit board. Signals passing through those units may be routed to components on the printed circuit board through traces in the board. One or more second type units may be integrated with the connector. Those units may be designed for attachment to a cable, which may provide signal paths to a location on the printed circuit board near relatively distant components.
Component mounted board and electronic device comprising the same
A component mounting board includes first and second substrates, a connection substrate, an interposer, and an electronic component. The first substrate has first and second surfaces opposing each other, a first side surface between the first and second surfaces, and a first signal pattern. The second substrate is disposed on the first substrate, has third and fourth surfaces opposing each other and a second side surface between the third and fourth surfaces, and includes a second signal pattern. The connection substrate is bent to connect the first and second side surfaces, and the interposer is disposed between the first and third surfaces and electrically connects the first and second signal patterns. The electronic component is mounted on at least one of the first to fourth surfaces.
POWER DISTRIBUTOR OF AN ELECTRICAL SYSTEM OF A MOTOR VEHICLE
A power distributor of an electrical system of a motor vehicle, including a circuit board, which has a main connection to a main circuit and multiple secondary connections. Each secondary connection is assigned to one secondary circuit and electrically contacted with the main connection via a circuit breaker having two connections. The connections of each circuit breaker are electrically contacted directly with the circuit board. The invention also relates to a circuit breaker.
Orthogonal cross-connecting of printed circuit boards without a midplane board
A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.
Electronic module with an electrically conductive press-fit terminal having a press-fit section
An electronic assembly includes an electronic module and an electric part. The electronic module includes an electrically conductive press-fit terminal. The electrically conductive press-fit terminal has a press-fit section. The electric part has a contact hole. The press-fit section is inserted in the contact hole and plastically deformed therein, such that the press-fit section both mechanically and electrically contacts the electric part in the plastically deformed state. A corresponding method of assembly is also described.
CABLE CONNECTOR FOR HIGH SPEED INTERCONNECTS
A cable termination that provides low signal distortion even at high frequencies. Conductive elements of the cable are fused to edges of signal conductors in a cable connector or other component terminating the cable. For terminating a differential pair, the conductive elements of the cable may be terminated to opposing edges of a pair of signal conductors in the cable termination. The conductive elements may be shaped such that the spacing between signal paths passing through the conductive elements of the cable and into the signal conductors of the cable termination is uniform.
Press-in pin for an electrical contacting assembly
The invention relates to a press-in pin (10) for an electrical contacting assembly (1), having an elastic press-in region (12) and an electrically conductive coating (14). The invention further relates to a corresponding contacting assembly (1), and to a method for joining a press-in pin (10) and a metallized via (7). The coating (14) comprises a reactive multi-layer applied to the press-in pin (10) and a first contact layer applied to the reactive multi-layer.
Positioning pins for foldable printed circuit board
An electronics device includes a folded printed circuit board which is folded about at least one fold region which defines a first section and a second section. A housing has a plurality of side portions. The first section of the folded printed circuit board is secured along an outer surface of a first side portion of the plurality of side portions. The housing further includes an interior. At least one first slot is defined within the interior and disposed along or near a second side portion arranged opposite the first side portion. At least one first pin member is disposed partly within the at least one first slot and extends therefrom. A distal end portion of the at least one first pin member engages with the second section of the folded printed circuit board so as to hold the second section in position over the interior of the housing.
Preformed solder-in-pin system
A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.