A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.

Foldable Compression Attached Memory Modules (fCAMMs) and associated apparatus, assemblies and systems. The fCAMM comprises a compression contact module having a plurality of contact means arranged in one or more arrays on its underside, first and second fold modules including multiple memory devices, and flexible interconnects coupling the compression contact module to the first and second fold modules. Under one assembled configuration, portions of printed circuit boards (PCBs) for the first and second fold modules are folded over portions of the compression contact module. Under another configuration, the first fold module is disposed above the second fold module, which is disposed above the compression contact module. In an assembly or system including a motherboard, a compression mount technology (CMT) connector or a land grid array (LGA) assembly is disposed between the motherboard and the compression contact module. Bolster plates are used to urge the compression contact module toward the motherboard.

A fastener (100) for retaining a plurality of components (334, 348) in an electronic device includes a body (102) with a bottom end and a top end, where the bottom end includes a mechanical interlocking feature (104) integrally formed with the bottom end and the top end includes a head (106) integrally formed with the top end. Between the head (106) and the mechanical interlocking feature (104), the body includes an integrally formed shoulder (108). A neck (110) is positioned between the shoulder (108) and the head (106) with a neck outer diameter that is less than a head outer diameter and a shoulder outer diameter.

A circuit board fastening system consists of a two-piece assembly including an electrically conductive circuit board retainer for surface mounting and a flexible clip for retaining a daughter-card to the retainer. The clip is preferably made of a flexible polymer so that a band portion in the middle of the clip can be comfortably folded 180 degrees at a u-shaped bend. During assembly, an arrow-shaped barb at one end of the clip is inserted into a retain bore thereby resiliently securing the daughter-card to a retainer flange upon which the card is seated. At the opposite end of the clip, a notched aperture in the clip is affixed around a groove in the retainer flange. The resilience of the barb provides a residual clamping effect to the daughter-card that is tightly sandwiched between a broad planar portion of the clip and a top surface of the retainer flange.

This converter comprises: a housing having heat dissipation fins formed on the top surface thereof; a printed circuit board disposed in the inner space of the housing; and a bus bar, the bottom surface of which is in surface contact with the top surface of the printed circuit board, wherein the heat dissipation fins and the bus bar can be disposed overlapping each other in a vertical direction to enhance heat dissipation efficiency and can be further reduced in weight.

A jumper assembly for connecting together first and second circuit boards. The jumper assembly includes a frame secured to a flexible circuit having a plurality of conductive traces. The frame includes a bridge that connects together first and second side structures, each having a window and a moveable lever. The first side structure is secured over the first circuit board and the second side structure is secured over the second circuit board. First end portions of the traces of the flexible circuit are secured to contact pads of the first circuit board, while second end portions of the traces of the flexible circuit are secured to contact pads of the second circuit board. The bridge of the frame is removed after the jumper assembly is secured to the first and second circuit boards.

A component having electrical connector elements for making contact with a circuit board, optionally having additional securing elements for mechanical stability after soldering or positioning devices for supporting components with an unfavourable center of gravity or supporting elements which can optionally be removed after the soldering process. The positioning devices or supporting elements serve to position components with different forms on a circuit board and to keep them in the correct orientation for the soldering process. Fitting takes place in a force-free manner and thus favours automation and the use of for example pick-and-place robots which take hold of and move the particular component via the positioning device connected thereto, engaging with and/or around either a contact element or a supporting element. The support of the positioning device allows a stable state during the soldering process. In a corresponding manner, methods for carrying out the soldering processes are specified.

A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.