Lighting devices and methods of manufacturing lighting devices are described. A lighting devices includes at least one thermally conductive element, at least one lighting module thermally coupled to the at least one thermally conductive element, and an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion. The at least one circuit board is mounted in the at least one receiving portion and is at least partially exposed from the overmould. The at least one circuit board includes at least one connector and at least two bond pads. The at least one connector includes surface accessible conduction lines.

Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

A fastening assembly includes: a first sleeve, a second sleeve, a positioning element, a driven element and an elastic element. The first sleeve includes a plug tube having a passage communicating with the first sleeve. The second sleeve is integrated into the first sleeve. The driven element includes an inserting rod movably inserted in the passage along a first direction and a guiding portion having a first inclined guiding surface forming a first acute angle with the first direction. The positioning element includes a guide rod movably inserted in the second sleeve along the second direction and a slide block connected to the guide rod and in sliding contact with the first inclined guiding surface. One end of the elastic element leans against the driven element, and the other end of the elastic element leans against the first sleeve.

A connector assembly is configured to connect a first circuit board and a second circuit board. The connector assembly includes a board-to-board connector, a buckle pressing plate and a pressing and covering piece. The buckle pressing plate and the board-to-board connector which is spaced from the buckle pressing plate are arranged on the second circuit board, and the board-to-board connector is connected with the first circuit board to enable the first circuit board to be electrically connected with the second circuit board. The pressing and covering piece includes a covering portion and a buckling portion extending from a first end of the covering portion. The buckling portion is connected to the buckle pressing plate in a buckling manner. The covering portion presses and covers the board-to-board connector to fix the board-to-board connector on the second circuit board. A power supply assembly and an electronic device are also provided.

A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

A board-like connector, a dual-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-arm bridges spaced apart from each other and an insulating layer. Each of the dual-arm bridges includes a carrier, a first cantilever, a second cantilever, a first abutting column, and a second abutting column, the latter two of which extend from the first and second cantilevers along two opposite directions. The first cantilever and the second cantilever extend from and are coplanar with the carrier. The insulating layer connects the carriers of the dual-arm bridges. The first abutting column and second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer, and are configured to abut against two boards, respectively.

A circuit carrier arrangement includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

Disclosed is a lamp with easy assembly and disassembly comprising a power socket and a lamp body. The power socket comprises a housing and a power supply assembly which is provided in the housing, the power supply assembly is connected with a power supply, the housing is provided with at least one mounting slot which is provided with a press-type locking socket and PCB probes, and the PCB probes are electrically connected with the power supply assembly, a mounting plug with an accommodating groove is provided on the lamp body, a press-type locking plug and a PCB board are provided in the mounting plug; the PCB board is electrically connected to the light source of the lamp body; when the mounting plug is inserted into the mounting slot, the push-type locking plug is inserted into the push-type locking socket and is locked.

An electric motor assembly includes a stator, a rotor, a motor housing, a rotatable shaft, a radial fan, and an air scoop. The motor housing at least partly houses the stator and rotor and presents an exterior motor surface. The rotatable shaft is associated with the rotor for rotational movement therewith, with the rotatable shaft extending along a rotational axis. The radial fan is mounted on the rotatable shaft exteriorly of the motor housing and is rotatable with the shaft to direct airflow in a radially outward direction. The air scoop extends radially outwardly relative to the radial fan and axially to receive radial airflow from the radial fan and turn the airflow axially to flow along the exterior motor surface. The air scoop includes spaced apart axially extending airflow vanes to guide the airflow as the airflow is turned axially.