The present disclosure provides for an example integrated optics assembly. The integrated optics assembly may include an optics mount, a substrate including a heat sink, and a photonic integrated circuit (“PIC”). The optics mount may be adapted to support a light source on a first end of the optics mount. The first end of the optics mount may be coupled to a region of the substrate including the heat sink. The heat sink may remove or dissipate the heat produced by the light source. A second end of the optics mount may be coupled to the PIC such that the optics mount extends between the substrate and the PIC. This may decrease the amount of space the optics mount takes up on the PIC thereby allowing the overall size of the PIC to be decreased. Decreasing the size of the PIC may allow for more PICS per wafer.

A socket configured to electrically connect a first electric component and a second electric component, the socket including: a base part including a top surface and a bottom surface; a contact pin provided to extend through the base part and including a pin lower end exposed from the bottom surface; and an abutment part provided in the base part, and including an abutment lower end, the abutment lower end being exposed from the bottom surface to abut on the second electric component and configured to be movable in a vertical direction, the abutment part being configured such that the abutment lower end abuts on the second electric component approaching, in a process of attaching the second electric component, the base part from below to adjust a posture of the base part with respect to the second electric component.

An electrical assembly includes a support element which has a body and a surface formed on the body, an electrical functional element arranged on the support element, and a temperature monitoring device arranged on the support element for monitoring a temperature on the electrical functional element. The temperature monitoring device includes a temperature sensor arranged on the surface of the support element, a physical contact element arranged on the surface of the support element, and at least one heat-conducting device embedded in the body of the support element. The at least one heat-conducting device extends at least in sections below the temperature sensor in the body and is thermally connected to the physical contact element via at least one through-connection. The physical contact element is thermally coupled to a coupling surface operatively connected to the electrical functional element.

A supporter for electronic parts includes: an adsorption plate which is attached to an upper surface of a first electronic part among the first electronic part and a second electronic part where the first electronic part and a second electronic part are spaced apart from each other on a plane; and a supporting member which includes 1) a first support part which supports a lower surface of the second electronic part and 2) a connection part which connects the adsorption plate and the first support part. On the plane, about 70-90% of the area of the first support part is overlapped with the second electronic part.

A fixing device for fixing a display card on a circuit board, includes a backplane and a support bracket. The backplane includes a substrate plate, and a first engaging part. The substrate plate is fixed on the display card. The first engaging part is disposed on the substrate plate. The support bracket includes at least one support leg and a second engaging part. The support leg includes a first end and a second end. The first end is connected with the circuit board. The second engaging part is connected with the second end and engaged with the first engaging part.

A board having an electronic component mounted thereon includes a capacitor body; a pair of external electrodes disposed on both ends of the capacitor body, respectively; a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions each having a protrusion on a lower side thereof, respectively; a board; and a pair of electrode pads disposed on an upper surface of the board and connected to the pair of metal frames, respectively, and each having a groove portion corresponding to the protrusion on an upper surface thereof.

A socket configured to electrically connect a first electric component and a second electric component, the socket including: a base part including a top surface and a bottom surface; a contact pin provided to extend through the base part and including a pin lower end exposed from the bottom surface; and an abutment part provided in the base part, and including an abutment lower end, the abutment lower end being exposed from the bottom surface to abut on the second electric component and configured to be movable in a vertical direction, the abutment part being configured such that the abutment lower end abuts on the second electric component approaching, in a process of attaching the second electric component, the base part from below to adjust a posture of the base part with respect to the second electric component.

The invention provides a stacked structure of circuit boards applied to a data storage device. The stacked structure comprises a main circuit board and a slave circuit board. The main circuit board comprises a controller, a plurality of flash memories, a first connector, and a first transmission interface. The slave circuit board comprises an operation management chip, a second connector, and a second transmission interface. The operation management chip comprises a microprocessor and a network communication element. The slave circuit board is stacked on the main circuit board, and connected to the first connector of the main circuit board via the second connector. When the slave circuit board receives a specific operation instruction, the microprocessor of the slave circuit board will transmit the specific operation instruction to the electronic apparatus via the second transmission interface, the electronic apparatus executes a corresponding operation according to the specific operation instruction.

The invention relates to a method for mechanical connecting especially of a potting frame to a printed circuit board of an electrical/electronic module. The potting frame includes a metal contact area. The printed circuit board includes a surface area structured metallically corresponding to the contact area. The method includes positioning the mechanical component with the contact area facing the corresponding surface area, and soldering the mechanical component to the printed circuit board via the contact area and the surface area. The method the advantage that a material saving encapsulation can be provided for electrical/electronic modules in explosion endangered regions. An additional process step for mechanical connecting of the encapsulation to the printed circuit board can be omitted, since the mechanical connecting of the potting frame can be performed in one process step together with the soldering of the additional electrical/electronic components to the printed circuit board.

A seat-plate-mounted capacitor includes a capacitor body and a seat plate. The capacitor body includes a case and a sealing member. The case includes a tubular part and a bottom wall that closes a first end of the tubular part. The sealing member closes a second end of the tubular part that is opposite to the first end. The capacitor body is disposed so that the sealing member is adjacent to the seat plate. The seat plate includes a base part and a support wall. The tubular part has an annular recess surrounding the tubular part, a first maximum diameter portion disposed closer to the bottom wall than the annular recess is, and a second maximum diameter portion disposed closer to the second end than the annular recess is. A diameter A of the first maximum diameter portion, a diameter B of the second maximum diameter portion, and an inner diameter C of the support wall satisfy a relation A>C>B, in a state that the capacitor body is not installed in the seat plate.