A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

An electronic assembly includes a printed wiring board (PWB), and a stiffener secured to the PWB. The stiffener includes one or more tray sections. One or more electronic modules is secured respectively to the one or more tray sections of the stiffener.

Lighting systems that include an LED and a silicone module designed to contain a lens are described herein.

A battery pack includes: a battery cell including first and second surfaces arranged at opposite sides and at which first and second electrodes are respectively located, and a side surface connecting the first and second surfaces to each other; a first circuit board arranged on the first surface and connected to the first electrode; a second circuit board arranged on the second surface; a first flexible line extending from a first side of the first circuit board to the second circuit board while surrounding a portion of the side surface of the battery cell; and a second flexible line extending from a second side of the first circuit board to the second surface of the battery cell while surrounding another portion of the side surface of the battery cell and connected to the second electrode.

An ultra-compact phototherapy apparatus for treating skin diseases includes: a PCB substrate in which a light emitting element and a pair of left and right first metal electrodes (positive pole) are formed on an upper surface and a second metal electrode is formed on a lower surface, a battery having a first electrode on an upper surface, which is in contact with the second metal electrode on the lower surface of the PCB substrate, and a second electrode on a lower surface, and an electrode body formed so that the battery is inserted inside and the PCB substrate is inserted in slidingly a front-rear direction, of which an upper inner side is selectively in contact with the first metal electrode of the PCB substrate.

A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

The invention provides a stacked structure of circuit boards applied to a data storage device. The stacked structure comprises a main circuit board and a slave circuit board. The main circuit board comprises a controller, a plurality of flash memories, a first connector, and a first transmission interface. The slave circuit board comprises an operation management chip, a second connector, and a second transmission interface. The operation management chip comprises a microprocessor and a network communication element. The slave circuit board is stacked on the main circuit board, and connected to the first connector of the main circuit board via the second connector. When the slave circuit board receives a specific operation instruction, the microprocessor of the slave circuit board will transmit the specific operation instruction to the electronic apparatus via the second transmission interface, the electronic apparatus executes a corresponding operation according to the specific operation instruction.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

A combination structure of a clamping member and a circuit board for a signal connector is disclosed. The clamping member includes two clamping members fixedly connected to two sides of the circuit board. Each clamping member has a pair of first positioning pins and a pair of second positioning pins. Thereby, the center of the guide pin can be guided and the guide pin won't be loosened, so as to improve the stability of the signal and reduce the loss.

A camera module includes a liquid lens unit, a lens holder in which the liquid lens unit is disposed, a main board configured to supply a driving signal to drive the liquid lens unit, and a base disposed between the liquid lens unit and the main board, the base being configured to transmit the driving signal output from the main board to the liquid lens unit, wherein the base includes a body in which the lens holder is disposed, a first pillar and a second pillar protruding upwards from the body, and a first connection part and a second connection part electrically connecting the liquid lens unit to the main board.