The present disclosure provides an unmanned aerial vehicle (UAV). The UAV includes a main body; an inertial measurement unit (IMU) disposed in the main body; a mounting bracket for fixing the IMU; and a circuit board fixedly disposed at the main body and integrated with a plurality of functional modules. The IMU is fixed on the circuit board through the mounting bracket.

A fixing device for fixing a display card on a circuit board, includes a backplane and a support bracket. The backplane includes a substrate plate, and a first engaging part. The substrate plate is fixed on the display card. The first engaging part is disposed on the substrate plate. The support bracket includes at least one support leg and a second engaging part. The support leg includes a first end and a second end. The first end is connected with the circuit board. The second engaging part is connected with the second end and engaged with the first engaging part.

An optical surface-mount device has a silicone lens member and a solderable support connected with the silicone lens member to facilitate solder reflow mounting of the device to a printed circuit board.

A seat-plate-mounted capacitor includes a capacitor body and a seat plate. The capacitor body includes a case and a sealing member. The case includes a tubular part and a bottom wall that closes a first end of the tubular part. The sealing member closes a second end of the tubular part that is opposite to the first end. The capacitor body is disposed so that the sealing member is adjacent to the seat plate. The seat plate includes a base part and a support wall. The tubular part has an annular recess surrounding the tubular part, a first maximum diameter portion disposed closer to the bottom wall than the annular recess is, and a second maximum diameter portion disposed closer to the second end than the annular recess is. A diameter A of the first maximum diameter portion, a diameter B of the second maximum diameter portion, and an inner diameter C of the support wall satisfy a relation A>C>B, in a state that the capacitor body is not installed in the seat plate.

Assembly workability of an electric compressor to which an inverter circuit section and a filter circuit section are attached is improved. The inverter circuit section (3) includes an inverter control board (17), a sleeve assembly (18), and a power module (14). The inverter control board, the sleeve assembly, and the power module are integrated. The filter circuit section (4) includes a filter circuit board (66) and a support member (67). The filter circuit board (66) and the support member (67) are integrated. The inverter circuit section and the filter circuit section are structured to be capable of being stored each individually within an inverter storing section (8) from the same direction and detachably attached to the housing (2).

An independent loading mechanism for use with a CPU connector includes a metallic frame cooperating with a back plate module to sandwich a printed circuit board therebetween. A plurality of screw nut units are provided around the four corners of the frame. A plurality of hollow spacers are secured to the corresponding through holes of the frame so as to allow the corresponding screw nut units moveable relative to the frame along the vertical direction within a range larger than a thickness of the frame, thus avoiding improper interference between the screw nut units and the corresponding screw posts of the back plate module during sequential screwing.

One embodiment includes a method for manufacturing an electronic apparatus, including bonding an integrated circuit (IC) die to a substrate to form an IC package using a first reflow process, which causes the substrate to warp, reversibly connecting a lid with the IC package over the IC die so that the lid applies a force to the IC die, providing a printed circuit board (PCB) including an array of first contact pads, respectively disposing an array of bonding elements on an array of second contact pads of the substrate, placing the IC package on to the PCB with respective ones of the bonding elements contacting respective ones of the first contact pads, performing a second reflow process to apply heat to the bonding elements to bond the first contact pads with the second contact pads, and removing the lid from the IC package after the second reflow process.

An electronic device includes a chip component and a metal terminal. The metal terminal is connected with the chip component. The metal terminal includes an electrode facing portion and a holding portion. The electrode facing portion is arranged correspondingly with an end surface of the terminal electrode of the chip component. The holding portion holds the chip component. A space region between the electrode facing portion and the end surface of the terminal electrode includes a joint region and a non-joint region. In the joint region, a connection member connects the electrode facing portion and the end surface of the terminal electrode. The non-joint region is formed without the connection member between a periphery of the joint region and the holding portion.

A keyboard includes a first substrate, a second substrate, a keyswitch circuit, a connecting member, and a keyswitch assembly. The first substrate has a first through hole. The second substrate is disposed on the first substrate and has a second through hole. The second through hole is connected to the first through hole and located within an inner edge of the first through hole. The keyswitch circuit is disposed on one of the first substrate and the second substrate. The connecting member is engaged with the second through hole and extended onto a bottom surface of the second substrate facing toward the first substrate. The keyswitch assembly is located on a top surface of the second substrate facing away from the first substrate, connected to the connecting member, and configured to trigger the keyswitch circuit.

An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.