A multi-layer ceramic electronic component includes: a ceramic body including first and second internal electrodes laminated in a first axis direction, first and second main surfaces facing in the first axis direction, and first and second end surfaces facing in a second axis direction orthogonal to the first axis, the first and second internal electrodes being drawn to those end surfaces; a first external electrode covering the first end surface and extending to the first main surface; and a second external electrode covering the second end surface and extending to the first main surface. Each external electrode includes a first region including a first outermost layer mainly containing tin and extending from the end surface to the first main surface, and a second region free from an outermost layer mainly containing tin and disposed adjacent to the first region in the first axis direction on the end surface.

An electrical connector assembly includes a carrier having an upper surface and a lower surface and having a plurality of contact openings therethrough. The electrical connector assembly includes contacts received in corresponding contact openings forming a contact array. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The contacts in the contact array have variable heights to vary relative positions of at least one of the upper mating interfaces or the lower mating interfaces of the contacts.

A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.

A land (22) and a wiring pattern (25a) are formed on a component mounting surface (3A) of a circuit board (3), and the wiring pattern (25a) is covered with a solder resist layer (26). An electrode part (21c) of an aluminum electrolytic capacitor (21) is soldered to the land (22) via a solder (27). An intermediate film (24a) formed of a part of a silk pattern (24) is printed on the solder resist layer (26), and by a thermosetting adhesive (23), the aluminum electrolytic capacitor (21) is bonded to the intermediate bonding film (24a). By the intermediate bonding film (24a), the stress of the adhesive (23) at the time of thermal shrinking is relaxed.

A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).

An electronic device includes a support wafer, an electronic chip and an encapsulating block for the electronic chip above the support wafer. The support wafer is provided with a first network of electrical connections and a second network of electrical connections formed solely by tracks. First electrical connection elements are interposed between first front electrical contacts of the electronic chip and rear electrical contacts of the first network. Second electrical connection elements are interposed between second front electrical contacts of the electronic chip and internal electrical contact zones of the tracks of the second network. The first network includes front external electrical contacts and the tracks exhibiting external electrical contact zones.

A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

An optical modulator includes: a bottom substrate layer, having a first surface; a traveling-wave electrode, being disposed on the first surface of the bottom substrate layer and including a plurality of ground electrodes and a plurality of signal electrodes between the ground electrode; an optical waveguide disposed inside the bottom substrate layer; and a shield layer, including a substrate and a metal layer, the substrate covering at least a portion of the traveling-wave electrode and the metal layer being disposed on the surface of the substrate facing away from the traveling-wave electrode. Each of the ground electrodes is electrically connected to the metal layer to provide electromagnetic shielding for the signal electrodes between the ground electrodes.

A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).

An electronic device includes an interposer substrate including a substrate body that includes a first principal surface and a second principal surface, a first surface terminal electrode that is provided on the first principal surface and includes a terminal electrode for heat dissipation and a terminal electrode for external connection, a second surface terminal electrode that is provided on the second principal surface, a conductor for signal transmission that is provided on the substrate body and connects the terminal electrode for external connection and the second surface terminal electrode, and a conductor for heat conduction that is provided on the substrate body and connects the terminal electrode for external connection or the second surface terminal electrode to the terminal electrode for heat dissipation.