An electric component includes: a semiconductor component including a heat radiating portion, a semiconductor element, a lead terminal, and a coating resin coating a part of each of the above; a wiring board including a first mounting portion, a second mounting portion, and an insulating substrate; a first solder connecting the first mounting portion and the heat radiating portion; and a second solder connecting the second mounting portion and the lead terminal. The first solder includes (a) a solder connecting portion connecting the heat radiating portion and the first mounting portion and (b) a flux provided around the solder connecting portion, and a third space which is provided as a space after excluding a second space that is an overlap of the heat radiating portion and the first mounting portion from a first space.

A magnetic electronic component includes a circuit board, a functional part, at least one magnet and at least one conductive fixing member. The circuit board has a circuit pattern. The functional part is arranged on the circuit board and are electrically connected to the circuit pattern. The magnet is located at one side of the circuit board. The conductive fixing member is configured to electrically connect the circuit pattern of the circuit board and fix the magnet.