An electronic device including an electromagnetic shielding structure is provided. The electronic device includes a printed circuit board, an antenna module, and an electromagnetic wave shielding structure. The antenna module includes a radio frequency integrated circuit mounted on the printed circuit board, and an array antenna coupled to an upper portion of the radio frequency integrated circuit. The electromagnetic wave shielding structure surrounds a side portion of the antenna module.

A manufacturing process to form a positioning control tool, such as a gyroscope, by using a three-dimensional (3D) printer printing a polymer material mixed with powdered graphene (12a) components (410) on a piezoelectric substrate (205), the components (410) include: a resonator (411) transducer configured to create a first surface acoustic wave (215); a pair of reflectors (412a, 412b) configured to reflect the first surface acoustic wave (215); a structure (413) which, when subjected to a Coriolis force, creates a second surface acoustic wave (230); a first sensor transducer (414) configured to sense the second surface acoustic wave (230); and a second sensor transducer (415) configured to sense a residual surface acoustic wave from a second region of the surface (210) of the piezoelectric substrate free of the structures that respond to the Coriolis force.

A print head assembly of a stencil printer includes a print head frame and a wiper blade assembly coupled to the print head frame. The wiper blade assembly includes wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The wiper blades are configured to force solder paste through the apertures of the stencil. The print head assembly further includes a dispensing unit coupled to the print head frame. The dispensing unit is disposed between the wiper blades to deposit solder paste between the wiper blades. The dispensing unit includes a cartridge receiver. The print head assembly further includes a cartridge positioned in the cartridge receiver and a sensor coupled to the print head frame proximate the cartridge. The sensor is configured to measure a temperature of the cartridge.

An extrusion printing process for conductive materials and a conductive material extrusion system. The process includes attaching a counter-electrode to a first side of a substrate. A drive voltage is applied to the counter-electrode and to a conductive material to be extruded onto a second side of the substrate, opposite the first side. The conductive material is extruded onto the second side of the substrate while the drive voltage is being applied to the counter-electrode and conductive material. The conductive material is selected from a metal having a melting point ranging from about ?20? C. to about 150? C.

A sealed squeegee for supplying a solder paste with a uniform density is disclosed. In the process of pressurizing and mixing the solder paste contained in a pressurization chamber by a pumping pad that contracts and expands according to injection and discharge of compressed air, the sealed squeegee minimizes a pressure change within the pressurization chamber due to a pressure shock within the pressurization chamber, reduces the number of components by coupling separate components of the existing buffer device and pressurization device into a single pumping pad, prevents a pressure drop within the pressurization chamber by improving sealing capability, prevents unnecessary waste of the solder paste through ease of disassembly and assembly by reducing the number of components and precision in discharging the appropriate amount of solder paste, and improves printing quality by improving Maycleanability for using different types of solder pastes.

A system and corresponding method for additive manufacturing of a three-dimensional (3D) object to improve packing density of a powder bed used in the manufacturing process. The system and corresponding method enable higher density packing of the powder. Such higher density packing leads to better mechanical interlocking of particles, leading to lower sintering temperatures and reduced deformation of the 3D object during sintering. An embodiment of the system comprises means for adjusting a volume of a powder metered onto a top surface of the powder bed to produce an adjusted metered volume and means for spreading the adjusted metered volume to produce a smooth volume for forming a smooth layer of the powder with controlled packing density across the top surface of the powder bed. The controlled packing density enables uniform shrinkage, without warping, of the 3D object during sintering to produce higher quality 3D printed objects.

A system for applying a coating to a substrate. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

Provided is a slot die with variable nozzles. The slot die with variable nozzles, which applies ink on a substrate to perform a coating process, includes: a first body having a cavity configured to accommodate ink supplied from the outside; a second body spaced apart from the first body in a transfer direction of a substrate or a direction opposite to the transfer direction; a shim plate coupled between the first body and the second body and having an discharge port configured to communicate with the cavity and discharge ink accommodated in the cavity toward the substrate; and a plurality of variable nozzles disposed at a lower end of the first body or the second body in a width direction of the substrate so as to be adjacent to the discharge port, wherein each of the plurality of variable nozzles is independently driven according to a state of the ink coated on the substrate and adjusts a partial discharge amount of the ink discharged from the discharge port by changing a partial area of the discharge port at an arrangement position thereof.