H05K2203/0126

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
20180146555 · 2018-05-24 ·

A display device and a manufacturing method thereof are provided. The display device includes a first substrate, a second substrate, a drive IC and a protection layer. The first substrate has a first region and a second region. The second substrate is correspondingly disposed on the first region. The drive IC is disposed on the second region. The protection layer is disposed enclosing the drive IC, and the protection layer has a maximum height larger than the height of the drive IC.

SCREEN PRINTER IMPROVED IN SOLDER SEPARATION AND METHOD OF CONTROLLING THE SAME
20180139875 · 2018-05-17 ·

Disclosed are a screen printer improved in solder separation and a method of controlling the same, in which close contact between a printed circuit board and a mask unit is enhanced to thereby improve the solder separation and stably supply a fixed quantity of solder supplied through a squeeze unit to the printed circuit board.

Fluid dispensing machine and method of dispensing fluid

A fluid dispensing machine includes a frame and a fixture held by the frame. The fixture is configured to support a substrate. A positioning system is supported by the frame. A guidance system is supported by the positioning system. The guidance system has a camera viewing the fixture that is movable relative to the fixture. A fluid dispenser is supported by the positioning system and is moved by the positioning system relative to the fixture. The fluid dispenser is configured to dispense fluid onto the substrate. A controller communicates with the positioning system and the guidance system. The controller operates the positing system to control a position of the fluid dispenser relative to the fixture based on an image obtained by the camera.

EMI SHIELDING STRUCTURE
20180116078 · 2018-04-26 ·

An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

PRINTING OF MULTI-LAYER CIRCUITS
20180114703 · 2018-04-26 ·

A sheet-fed system designed to print multilayer PCBs is introduced. The system consists of four main blocks; a drilling station, a patterning station, a stacking/bonding station, and a sintering zone. The substrate PCB is shuttled between these various stations, to have vias drilled, to be attached to stacks of previously-processed layers, to be covered with conductive paths by means of the aforementioned ink, and to have the ink sintered under a controlled temperature and atmosphere. Patterning is accomplished by means of a novel two-step method involving both high-temperature conductive elements, low-temperature conductive elements, and flux. Two such compositions are successively applied and individually sintered to form a single conductive path; the second application serves to fill the porosities of the first layer. By this method, a highly-conductive trace is obtained without requiring high temperatures, which in turn allows use of common substrates including polymers.

METHOD AND APPARATUS TO CREATE ELECTRICAL JUNCTIONS FOR INFORMATION ROUTING IN TEXTILE STRUCTURES
20180102619 · 2018-04-12 ·

Disclosed are systems or apparatuses and methods for forming a junction between conductive fibers that are incorporated into a fabric. Briefly, one method includes the steps of removing insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, bringing the exposed individually conductive fibers into contact with each other at a junction point, and forming a molecular bond between the conductive fibers at the junction point. Also disclosed are systems for forming a junction between conductive fibers that are incorporated into a fabric. In this regard, one embodiment of such a system can include a first apparatus that removes insulation from two intersecting individually insulated conductive fibers to expose the individually conductive fibers, a second apparatus that brings the exposed individually conductive fibers into contact with each other at a junction point, and a third apparatus that aids in formation of a molecular bond between the conductive fibers at the junction point.

Liquid material discharge apparatus and method
09919336 · 2018-03-20 · ·

A liquid material discharge apparatus and a method which can easily adjust a movement speed of a plunger. An Example of liquid material discharge apparatus includes a liquid chamber (50) which communicates with a discharging port (11) and to which a liquid material is supplied; a plunger whose rear end portion has a piston (33) and whose front end portion moves forward and rearward inside the liquid chamber (50); an elastic body (47) which applies a biasing force to the plunger; and a pressurizing chamber (49) in which the piston (33) is arranged and to which compressed gas is supplied. The liquid material is discharged through the discharging port (11) by the plunger to move forward fast, the elastic body (47) biases the plunger in a rearward movement direction, and the compressed gas applies a driving force to the piston (33) to cause the plunger to move forward.

Component-embedded substrate
09918381 · 2018-03-13 · ·

A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered.

METHOD OF CALIBRATING A DISPENSER

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

EMI SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF
20180042147 · 2018-02-08 · ·

An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.