A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

A circuit-forming method includes a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin, and a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device. A circuit-forming apparatus includes a first discharge device configured to form a resin layer including a recessed portion by discharging a curable resin, and a second discharge device configured to form an electrode inside the recessed portion by discharging a conductive paste by referring to a first mark formed by the first discharge device.

In a method for producing an electrical and/or communication connection between at least two components arranged in a switchgear cabinet for transferring electrical energy or for transporting data, an electrically conductive material is applied to a back wall of the switchgear cabinet. The electrically conductive material includes metal and is applied to the back wall in the form of a wire. While being applied to the back wall of the switchgear cabinet, the electrically conductive material is warmed or heated in such a way as to become liquid during application.

A solder supply system that judges whether a solder cup is set on a solder supply device. In a case in which it is judged that the solder cup is set on the solder supply device, reading a barcode by a barcode reader is allowed. In contrast, in a case in which it is judged that the solder cup is not set on the solder supply device, reading a barcode by the barcode reader is restricted. That is, reading a barcode by the barcode reader before the solder cup is set inside an outer tube is restricted, while reading a barcode by the barcode reader is allowed when the solder container is set inside the outer tube.

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser are disclosed. Initially, a dispenser is continuously moved through a constant motion trajectory connecting the plurality of dispense locations on the substrate. The electrical output signals generated by one or more of encoders of the dispenser are monitored as the dispenser is continuously moved through the constant motion trajectory. The dispenser is triggered at each of the plurality of dispense locations and droplets of the fluid material are jetted while continuously moving the dispenser. The spatial coordinates of each droplet of the fluid material on the substrate are measured and compared to expected landing coordinates for each droplet of the fluid material to generate a spatial error for each droplet of the fluid material. At least one dispense location is corrected and an updated constant motion trajectory is generated.

The present disclosure relates to a method, to distribute a solder-reinforced adhesive on a first substrate (110), comprising (i) positioning the first substrate (110) to receive an adhesive composite (250) including, an adhesive (200) and a plurality of solder balls (300) on a first contact surface (115) of the first substrate (110), (ii) applying, by a distribution nozzle (205), on the first contact surface (115), the adhesive composite (250), and (iii) distributing, by a conductive spreader (520), the adhesive composite (250). The present disclosure further relates to a method to determine electrical resistance of an solder-reinforced adhesive between a first substrate (110) and a second substrate (120), comprising (i) applying, by a distribution nozzle (205), on a first contact surface (115) of the first substrate (110), an adhesive composite (250) including, an adhesive (200) and a plurality of solder balls (300), (ii) positioning, to a portion of the adhesive composite (250) opposite the first contact surface (115), a second contact surface (125) of the second substrate (120), (iii) attaching, to the first substrate (110) and the second substrate (120), at least one electrical resistance detector (550), and (iv) applying, to the first substrate (110) and the second substrate (120), an electrical current.

An apparatus and method for placing components on an electronic circuit is disclosed. An adhesive applicator applies an adhesive to the electronic circuit. A component pick-and-place head places a component on the adhesive. A heater supplies sufficient heat to the electronic circuit to melt the adhesive and an outer portion of a contact pin of the component.

An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

Methods for applying fluid materials to a substrate, such as circuit board, while continuously moving the fluid dispenser. Some methods generally involve correcting the dispense location for each of the dispensed amounts of fluid material by executing a statistical comparison of either the predicted and actual landing locations on the substrate, or the predicted and actual positions of the dispenser at each of the dispense locations. Other methods generally involve initiating the dispensing of amounts of the fluid material at dispense locations corrected by a correction factor specified in terms of the servo cycle for the movement of the dispenser or by a correction factor specified in terms of partial servo cycles courtesy of a timer.